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Workpiece dividing device and method for dividing workpiece

A workpiece and process technology, applied in the field of workpiece separation device and workpiece separation, can solve the problems of quality degradation, excessive viscosity, material utilization rate reduction, etc., and achieve the effect of preventing quality degradation, avoiding workpiece transportation, and preventing quality degradation.

Active Publication Date: 2014-06-25
TOKYO SEIMITSU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, there are problems of chip breakage, quality degradation, and reduction in material utilization.
[0011] In addition, when tensioning the slack tape, in the case of overheating the atmosphere with a full-surface heater, etc., the tape that was cooled and embrittled is also heated, causing it to become excessively viscous
That is, after that, when the chip is peeled from the dicing tape, the chip cannot be completely peeled off from the dicing tape due to the influence of the DAF having excessive adhesive force.
Depending on the situation, there may also be cases where DAFs stick to each other, resulting in poor separation between chips

Method used

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  • Workpiece dividing device and method for dividing workpiece
  • Workpiece dividing device and method for dividing workpiece
  • Workpiece dividing device and method for dividing workpiece

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Embodiment Construction

[0071] Hereinafter, a workpiece dividing device and a workpiece dividing method according to the present invention will be described in detail with reference to the drawings.

[0072] figure 1 It is a sectional view of main parts showing the first embodiment of the workpiece dividing device according to the present invention.

[0073] like figure 1 As shown, the workpiece dividing device 1 includes a freezing chuck (frozen chuck table) 10 and a ring 12 for jacking up. On the freezing suction cup 10, there are Figure 28 As shown, a semiconductor wafer W is mounted on a work 2 on a frame F via a dicing tape S. As shown in FIG. It is to be noted that the dicing tape S is attached to the back surface of the semiconductor wafer W via a DAF (Die Attach Film) D (hereafter, referred to as DAF (D).). Here, for example, the thickness of the semiconductor wafer W is about 50 μm, and the thicknesses of the DAF (D) and the dicing tape S are each about several μm to about 100 μm.

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Abstract

The invention provides a workpiece dividing device capable of preventing quality weakening due to loosening of a cutting strip and a method for dividing workpieces. The workpiece dividing device applied for cutting workpieces attached on the cutting strip thorugh chip adhering membranes into each chip along a preformed predetermined dividing line comprises workpieces composed of semiconductor chips with predetermined dividing lines; a selective cooling mechanism applied for optionally cooling chip adhering membrane zones of predetermined dividing lines belonging to the workpieces attached on the chip adhering membranes; a workpiece dividing mechanism applied for expanding the cutting strip after the cooling and dividing the workpieces and the chip adhering membranes; a selective heating mechanism applied for heating parts except the cutting strip zones having workpieces attached through chip adhering membranes thereon and eliminating loosening of the cutting strip due to the expansion.

Description

technical field [0001] The present invention relates to a workpiece dividing device and a workpiece dividing method, in particular to a semiconductor wafer which is mounted on a ring-shaped frame via a dicing tape and is cut and grouped into individual chips, and which is divided into individual chips by expanding the dicing tape after the dicing process A splitting device and a workpiece splitting method. Background technique [0002] Currently, when manufacturing a semiconductor chip, for example, a semiconductor wafer is passed through a dicing tape (adhesive tape, adhesive sheet) with a film-like adhesive for die bonding called DAF (Die Attach Film). In the workpiece laid on the frame, the semiconductor wafer and the DAF are divided into individual chips by expanding (expanding) the dicing tape, wherein the semiconductor wafer has predetermined separation lines formed therein in advance by laser irradiation or the like. [0003] exist Figure 28 Workpieces are shown in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301H01L21/67B28D5/00
Inventor 清水翼藤田隆小岛恒郎
Owner TOKYO SEIMITSU
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