TO92S packaging box and matched die

Abstract

The invention relates to a TO92S packaging box and a matched die. The TO92S packaging box comprises a lead frame, pins, connecting pads, locating holes and a seal shell, wherein the connecting pads are arranged in an empty loop arranged on an islet on the head of the lead frame; the lower parts of the connecting pads are connected with the pins through metal leads; the outside of the whole islet is sealed by the seal shell; on the lead frame, the quantities of the locating holes and the connecting pads are respectively 60 and 35 in a single row; the lead frame is 0.34mm thick and 17.3mm wide; the seal shell is a trapezoid of which the middle is provided with a concave circle; and the correspondingly matched TO92S packaging die has 1480 molds, and the die colloid flow passage adopts a narrow type. The invention improves the packaging frame and the corresponding die, and perfects the use of equipment and raw materials in production, so that the equipment can operate better, faster and more precisely, and produce more products under the condition of the same quantity.

Description

technical field [0001] The invention relates to a TO92S type semiconductor package, in particular to an improved TO92S type package box and a supporting mold. Background technique [0002] Semiconductor packaging refers to the process of processing the wafers that have passed the test to obtain independent chips according to the functional requirements of the product model. The packaging of semiconductor chips is to paste the cut wafers on the small island of the lead frame with glue, and then use ultra-fine metal wires. The wiring pads of the chip are connected to the corresponding pins of the substrate, and then the independent chip is sealed and protected with a sealed casing. The package box of the semiconductor package of the model TO92S adopts a single row of 50 pieces, mainly 25 pieces, and the thickness is 0.38 mm and a width of 23.8mm, and the corresponding matching mold adopts a structure with a mold size of 1200 pieces. In this way, the use of raw materials and pr...

AI Technical Summary

Problems solved by technology

[0002] Semiconductor packaging refers to the process of processing the wafers that have passed the test to obtain independent chips according to the functional requirements of the product model. The packaging of semiconductor chips is to paste the cut wafers on the small island of the lead frame with glue, and then use ultra-fine metal wires. The wiring pads of the chip are connected to the corresponding pins of the substrate, and then the independent chip is sealed and protected with a sealed casing. The package box of the semiconductor package of the model TO92S adopts a single row of 50 pieces, mainly 25 pieces, and the thickness is 0.38 mm, the width is 23.8mm, and the corresponding matching mold adopts a structure with a mold size of 1200 pieces. In this way, the use of raw materials and production efficiency are limited to a certain extent.

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