Coating film forming method and coating film forming device

Abstract

The present invention provides a coating film forming method and a coating film forming device. In the coating film forming method, treating fluid is ejected from a slit-shaped ejection port to a substrate to form a coating film, regardless of a fluid volume of the ejection port of a nozzle and variation of an ejection pressure of the ejection port of the nozzle, a film thickness forming can be stably performed without depending on proficiency of an on-site operator, so that an effective area of the coating film formed on the substrate can be enlarged. The coating film forming method comprises the steps of: setting a presumed film thickness Th within elapsed time Ts by utilizing a formula (1), substituting a target film thickness in the formula (1) to act as the presumed film thickness Th, setting a relative movement speed V of a substrate as a variable, and calculating a movement speed or the relative movement speed V of the substrate every other the elapsed time Ts; and controlling the movement speed or the relative movement speed V of the substrate according to the movement speed or the relative movement speed V of the substrate calculated every other the elapsed time Ts. Th = (delta B + Q) * beta / (Ts * V * L) (1).

Description

technical field [0001] The present invention relates to a coating film forming method and a coating film forming apparatus for spraying a treatment liquid onto a substrate from a slit-shaped discharge port to form a coating film with a predetermined film thickness. Background technique [0002] For example, in the manufacturing process of an FPD (flat panel display: FLAT PANEL DISPLAY), a circuit pattern is formed by a so-called photolithography process. [0003] In this photolithography process, after forming a predetermined film on a substrate such as a substrate, a photoresist (hereinafter referred to as a resist) as a processing liquid is applied to form a resist film (photosensitive film). Then, the said resist film is exposed according to a circuit pattern, and the exposed said resist film is developed and patterned. [0004] In such a photolithography process, as a method of applying a resist solution to a substrate to form a resist film on the substrate, for example...

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Problems solved by technology

[0021] However, for the method of repeating the test coating process many times as described above and obtaining the optimum conditions of the coating process by trial and error, there is the following problem: not only the operator on site is required to have a good Proficiency and long working hours, and because many substrates are used for the coating process for the test, there is complexity and cost increase in the system at the time of implementation

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