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Light-emitting diode structure with metal reflection surface and heat sink

A technology of light-emitting diodes and reflective structures, applied in semiconductor devices, lighting and heating equipment, cooling/heating devices for lighting devices, etc., can solve problems such as poor light extraction efficiency

Inactive Publication Date: 2012-09-19
LEXTAR ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the reflective surface of the metal bracket or the inner surface of the cup wall, the light can quickly avoid the total reflection, so as to solve the problem of poor light output efficiency caused by the total reflection of the light of the traditional light-emitting diode in the package.

Method used

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  • Light-emitting diode structure with metal reflection surface and heat sink
  • Light-emitting diode structure with metal reflection surface and heat sink
  • Light-emitting diode structure with metal reflection surface and heat sink

Examples

Experimental program
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Embodiment Construction

[0034] The invention provides a light-emitting diode with a metal reflective surface and a cooling block. The light-emitting diode structure mainly includes the metal bracket of the light-emitting diode; the metal material can be copper, copper alloy or a structure including silver plating on the metal reflective surface. In a preferred embodiment, the light-emitting diode can be used as a light-emitting diode lighting, a backlight source for a liquid crystal television or a liquid crystal panel.

[0035] Such as figure 2 The sectional view of the light-emitting diode metal bracket 100 and the bowl cup structure 502 shown, the light-emitting diode metal bracket 100 mainly includes a platform part 200 and a heat dissipation part 300; the platform part 200 has a surface 206 and is located on the table surface 206 opposite The first reflective wing 401 and the second reflective wing 402 on one side 201 and the second side 202 . The first reflective wing 401 and the second refl...

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PUM

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Abstract

The invention provides a light-emitting diode structure with a metal reflection surface and a heat sink, comprising a light-emitting diode support, a light-emitting chip, and a bowl structure. The light-emitting diode support has a platform and a heat sink. The platform has a top face, a first side, and a second side opposite to the first side. A first reflector and a second reflector respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dispassion surface of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.

Description

technical field [0001] The invention relates to a light-emitting diode and its metal support; specifically, the invention relates to a light-emitting diode and its metal support with heat dissipation effect and high light extraction rate. Background technique [0002] Light-emitting diodes have the characteristics of low power consumption and long service life, and are widely used in architectural landscape decoration, indoor lighting, commercial space, public transportation, automobiles, computers, mobile phones and other fields. Generally speaking, from the perspective of the current mainstream 5630 package (that is, the standoff size is 5.6mm in length and 3.0mm in width), although it has a heat dissipation design, its luminous efficiency and heat dissipation design are obviously insufficient as customer needs increase. The main issues of the light emitting diode packaging process include light extraction rate and heat dissipation. [0003] Such as figure 1 As shown, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/60F21V29/505
CPCH01L33/60H01L33/642
Inventor 许晋彰许峰荣王君伟梁建钦
Owner LEXTAR ELECTRONICS CORP
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