Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solid state imaging device, method of producing solid state imaging device, and electronic apparatus

A technology of solid-state imaging device and manufacturing method, which is applied in the direction of electric solid-state devices, radiation control devices, circuits, etc., can solve problems such as difficult design, and achieve the effect of increasing production and reducing changes

Active Publication Date: 2012-09-26
SONY CORP
View PDF5 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a structure, the transfer channel and the overflow channel are basically the same when transferring signal charges, so it is difficult to design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Solid state imaging device, method of producing solid state imaging device, and electronic apparatus
  • Solid state imaging device, method of producing solid state imaging device, and electronic apparatus
  • Solid state imaging device, method of producing solid state imaging device, and electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] 1. First Embodiment: Solid-state Imaging Device

[0035] 1-1. Overall structure of solid-state imaging device

[0036] 1-2. Structure of main parts

[0037] 1-3. Manufacturing method

[0038] 1-4. Operation

[0039] 1-5. Modification 1

[0040] 1-6. Modification 2

no. 2 approach

[0041] 2. Second Embodiment: Manufacturing Method of Solid-State Imaging Device

no. 3 approach

[0042] 3. Third Embodiment: Manufacturing Method of Solid-State Imaging Device

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a solid state imaging device, a method of producing solid state imaging device, and an electronic apparatus. A solid state imaging device includes: a substrate; a photoelectric conversion unit that is formed on the substrate to generate and accumulate signal charges according to light quantity of incident light; a vertical transmission gate electrode that is formed to be embedded in a groove portion formed in a depth direction from one side face of the substrate according to a depth of the photoelectric conversion unit; and an overflow path that is formed on a bottom portion of the transmission gate to overflow the signal charges accumulated in the photoelectric conversion unit.

Description

[0001] Cross References to Related Applications [0002] This application contains subject matter related to that disclosed in Japanese Priority Patent Application JP 2011-063974 filed in the Japan Patent Office on Mar. 23, 2011, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a solid-state imaging device having a vertical transistor, a method of manufacturing the solid-state imaging device, and electronic equipment provided with the solid-state imaging device. Background technique [0004] The solid-state imaging device is classified into an amplifying solid-state imaging device represented by a device such as a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image sensor, or a solid-state imaging device represented by a device such as a charge coupled device (Charge Coupled Device, CCD). The device is a representative charge transport type solid-state imaging ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/146
CPCH01L27/14607H01L27/1461H01L27/14641H01L27/14656H01L27/14689H01L27/14612H01L27/14643H01L27/14614H01L27/14625H01L27/1464
Inventor 中村良助
Owner SONY CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com