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Method for preparing organosilicone hybrid resin and power type encapsulating material for light-emitting diodes (LED) thereof and application

A hybrid resin and encapsulation material technology, applied in organic insulators, plastic/resin/wax insulators, coatings, etc., can solve the problem of light transmittance, bonding strength, and aging resistance of epoxy silicone encapsulation materials for LEDs And moisture absorption, affecting the uniformity of packaging materials and light transmittance, non-adjustable and other issues

Active Publication Date: 2014-08-20
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the poor compatibility of the two phases of epoxy resin and silicone, the above-mentioned separate physical blending method makes epoxy and silicone easy to phase separate in the system, which often affects the uniformity and light transmittance of the packaging material; At the same time, the refractive index of epoxy resin and silicone is generally not high, and the refractive index of the prepared material is usually low (about 1.5), and it is fixed but not adjustable; in addition, due to the presence of epoxy in the material, it still Has a certain hygroscopicity
Epoxy silicone packaging materials for LEDs prepared by using such materials are difficult to simultaneously take into account the properties of light transmittance, hardness, adhesive strength, refractive index, aging resistance and moisture absorption.

Method used

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  • Method for preparing organosilicone hybrid resin and power type encapsulating material for light-emitting diodes (LED) thereof and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] (1) Preparation of silicone hybrid resin

[0052] Take 40g CF 3 CH 2 CH 2 Si(OCH 3 ) 3 (Hangzhou Jessica Chemical Co., Ltd.), 10gOC 6 h 9 CH 2 CH 2 Si(OCH 3 ) 3 (Ark (Fogang) Chemical Materials Co., Ltd.), 100g diphenyldimethoxysilane (C 6 h 5 ) 2 Si(OCH 3 ) 2 (Zhejiang Chemical Technology Group Co., Ltd.), 30g distilled water, 2.0g dibutyltin dilaurate and 150g 2-butanone solvent are mixed in a round-bottomed flask reactor equipped with a stirrer, reflux condenser and thermometer, and the temperature is raised after stirring Reaction at 80°C for 8h. After the reaction was completed, the reaction was carried out by a rotary evaporator at 50°C and a vacuum of 10 4 The water, solvent and by-products were removed by rotary evaporation under Pa condition for 2 h, and a colorless, transparent and viscous organosilicon hybrid resin was prepared.

[0053] With GPC, FT-IR and 1 H NMR characterizes the structure of the product, wherein, the number average molec...

Embodiment 2

[0058] (1) Preparation of silicone hybrid resin

[0059] Take 2g n-C 8 f 17 C 2 h 4 Si(OCH 3 ) 3 (Ark (Fogang) Chemical Materials Co., Ltd.) (n refers to C in the molecular formula 8 is a straight chain containing 8 carbon atoms), 30g OCH 2 CHCH 2 OC 3 h 6 Si(OCH 3 ) 3 (Ark (Fogang) Chemical Materials Co., Ltd.), 100g C 6 h 5 Si(OCH 3 ) 3 (Zhejiang Chemical Technology Group Co., Ltd.), 5g of distilled water, 5g of stannous octoate, and 120g of methyl isobutyl ketone were mixed in a round-bottomed flask reactor equipped with a stirrer, reflux condenser, and thermometer. Reaction 24h. After the reaction was completed, the reaction was carried out at 100°C with a vacuum of 5ⅹ10 3 The water, solvent and by-products were removed by rotary evaporation for 0.5 h under Pa condition, and a colorless, transparent and viscous organosilicon hybrid resin was prepared.

[0060] With GPC, FT-IR and 1 The structure of the product was characterized by H NMR. The number aver...

Embodiment 3

[0065] (1) Preparation of silicone hybrid resin

[0066] Take 8g C 6 f 13 C 2 h 4 Si(OC 2 h 5 ) 3 (Harbin Xuejia Fluorosilicon Chemical Co., Ltd.), 90gOCH 2 CHCH 2 OC 8 h 16 Si(OCH 3 ) 3 (Guangzhou Jiachang Chemical Trading Co., Ltd.), 100g (C 6 h 5 ) 2 Si(OCH 3 ) 2 (Zhejiang Chemical Technology Group Co., Ltd.), 40g distilled water, 1.5g dibutyl tin diacetate and 100g 1,4-dioxane are mixed in the round bottom flask reactor that stirrer, reflux condenser, thermometer are equipped with, After stirring evenly, react at 70°C for 12h. After the reaction was completed, the reaction was carried out at 80°C with a vacuum of 7ⅹ10 by a rotary evaporator. 3 The water, solvent and by-products were removed by rotary evaporation for 1 h under Pa condition, and a colorless, transparent and viscous organosilicon hybrid resin was prepared.

[0067] With GPC, FT-IR and 1 The structure of the product was characterized by H NMR. The number average molecular weight of the pro...

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Abstract

The invention discloses a method for preparing organosilicone hybrid resin and a power type encapsulating material for light-emitting diodes (LED) thereof and application. According to the method, the organosilicone hybrid resin containing three functional groups of an epoxy group, a fluorin group and a phenyl group is prepared by a cohydrolysis condensation method, and the content of each group in the resin is optimized by controlling the ratios of fluoro alkyl silicane, epoxy alkyl silicane and phenyl silicane, so that the resin is applied to the power type encapsulating material for the LEDs. The prepared encapsulating material has the advantages of epoxy resin and organosilicone, has high performance of high light transmittance and refractive index, low hygroscopicity, high mechanical property and ageing-resistant performance and the like, and the problems of low light output rate, short service life and the like of the LEDs due to dropping caused by low bonding strength and poor mechanical property of the ordinary organosilicone material for encapsulating LEDs are solved. The method for preparing the organosilicone hybrid resin and the power type encapsulating material for the LEDs is simple, and raw materials are readily available and environment-friendly; and the organosilicone hybrid resin can also be used as the raw materials to be applied to processing and preparation of optical lens materials, photovoltaic conversion materials, integrated circuit encapsulating materials, insulating materials, coating materials, adhesives and the like.

Description

technical field [0001] The invention belongs to the field of light-emitting semiconductor packaging materials, and in particular relates to a preparation method and application of an organosilicon hybrid resin and a power LED packaging material thereof. technical background [0002] Since the first red LED came out in 1962, LED has been developed for more than 40 years, and its packaging method has also experienced development stages such as bracket type, patch type, and power type LED. In recent years, with the increase of chip power, especially the demand for the development of solid-state lighting technology, new and higher requirements have been put forward for the optical, thermal, electrical and mechanical structures of LED packaging, and correspondingly require LED packaging materials It has high refractive index, light transmittance and thermal conductivity, low stress and moisture absorption, excellent heat resistance and UV aging resistance, etc., to improve the li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/24C08G77/16C08L83/08C08L83/06C09D183/08C09D183/06C09J183/08C09J183/06H01L33/56H01B3/46
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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