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MEMS microphone chip

A technology of microphone and chip, which is applied in the direction of electrostatic transducer, microphone, etc.

Inactive Publication Date: 2012-10-03
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a kind of MEMS microphone chip whose size of the diaphragm and the polar plate are relatively large and is not easy to break due to problems such as external drop and acceleration impact, thereby improving the overall sensitivity and signal-to-noise ratio of the MEMS microphone.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 , figure 2 As shown, the MEMS microphone chip in this embodiment includes a substrate 1 and a parallel plate capacitor arranged on the substrate 1, and the parallel plate capacitor is composed of an integrally arranged diaphragm 2, an integrally arranged pole plate 3 and an The isolation layer 4 between the diaphragm 2 and the pole plate 3 is formed, the isolation layer 4 is composed of two integrally formed square isolation ring units 41, and the two isolation ring units 41 connect the diaphragm 2 and the pole plate 3 are isolated to form two capacitor units, and the positions of the parallel plate capacitors and the isolation ring units 41 are fixed on the base 1, and the base 1 is provided with two through holes 10 , the two through-holes 10 are respectively provided corresponding to the two capacitor units, and the positions corresponding to the capacitor units on the electrode plate 3 are respectively provided with electrode plate holes 30 .

[...

Embodiment 2

[0031] Such as image 3 , Figure 4 As shown, the MEMS microphone chip in this embodiment includes a substrate 1 and a parallel plate capacitor arranged on the substrate 1, and the parallel plate capacitor is composed of an integrally arranged diaphragm 2, an integrally arranged pole plate 3 and an The isolation layer 4 between the diaphragm 2 and the pole plate 3 is formed, the isolation layer 4 is composed of two integrally formed square isolation ring units 41, and the two isolation ring units 41 connect the diaphragm 2 and the pole plate 3 are isolated to form two capacitor units, and the positions of the parallel plate capacitors and the isolation ring units 41 are fixed on the base 1, and the base 1 is provided with two through holes 10 , the two through holes 10 are respectively provided corresponding to the two capacitor units, and the pole plate holes 30 are respectively provided at positions corresponding to the two capacitor units on the pole plate 3 .

[0032] In...

Embodiment 3

[0036] Such as Figure 5 As shown, the MEMS microphone chip in this embodiment includes a substrate 1 and a parallel plate capacitor arranged on the substrate 1, and the parallel plate capacitor is composed of an integrally arranged diaphragm 2, an integrally arranged pole plate 3 and an The isolation layer 4 between the diaphragm 2 and the pole plate 3 is formed, the isolation layer 4 is composed of four integrally formed square isolation ring units 41, and the four isolation ring units 41 connect the diaphragm 2 and the pole plate 3 are isolated to form four capacitor units, and the positions of the parallel plate capacitors and the isolation ring units 41 are fixed on the base 1, and the base 1 is provided with four through holes 10 , the four through holes 10 are respectively provided corresponding to the four capacitor units, and the pole plate holes 30 are respectively provided at positions corresponding to the four capacitor units on the pole plate 3 .

[0037] In this...

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Abstract

The invention discloses an MEMS (Micro-electromechanical System) microphone chip which comprises a base and a parallel plate capacitor comprising a diaphragm, an isolation layer and a polar plate. The isolation layer comprises a plurality of spacing ring units; each spacing ring unit separates the diaphragm and the polar plate into a plurality of capacitor units; the parallel plate capacitor is fixed on the base in a position relative to each spacing ring unit; through holes respectively arranged corresponding to the capacitor units are formed on the base; and pole plate holes are formed on the pole plate in positions corresponding to the capacitor units. The design can be used for manufacturing large diaphragms and pole plates, so that the integral sensitivity and signal noise ratio of an MEMS microphone are improved, and the structure that parallel plate capacitor is fixed on the base in the position relative to each spacing ring unit greatly enhances the mechanical reliability of the diaphragm and the pole plate, avoids the defect of poor dropping resistance caused by large areas of the diaphragm and the pole plate, and effectively enhances the rate of finished products.

Description

technical field [0001] The invention relates to a MEMS microphone, and more specifically relates to a MEMS microphone chip. Background technique [0002] In recent years, MEMS microphones integrated with MEMS (Micro-Electro-Mechanical-System, referred to as MEMS) technology have begun to be applied in batches to electronic products such as mobile phones and notebook computers. Favored by some microphone manufacturers. [0003] The MEMS microphone is an integrated microphone, which consists of an outer package structure and a circuit board. The package structure is provided with a sound channel, and a MEMS microphone chip and an ASIC (Application Specific Integrated Circuits, referred to as ASIC) chips. The MEMS microphone chip includes a substrate and a parallel-plate capacitor arranged on the substrate. A conventional parallel-plate capacitor consists of a diaphragm, a pole plate and a support arranged between the diaphragm and the pole plate. The MEMS microphone of this ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
Inventor 蔡孟锦孙德波
Owner GOERTEK INC