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Device and method for monitoring pad conditioner

A monitoring device and a technology for grinding discs, which are applied to the monitoring of grinding disc regulators and the monitoring device field of grinding disc regulators, can solve the problems of inaccurate pressure values ​​of grinding disc regulators, etc., so as to avoid product scrap and reduce production costs. Effect

Active Publication Date: 2012-10-17
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the inaccurate pressure value of the grinding disc regulator monitored by traditional grinding equipment, it is necessary to provide a monitoring device for the grinding disc regulator

Method used

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  • Device and method for monitoring pad conditioner
  • Device and method for monitoring pad conditioner
  • Device and method for monitoring pad conditioner

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Embodiment Construction

[0023] In order to make the objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] figure 2 It is a structural diagram of a monitoring device for a grinding disc adjuster in an embodiment, including a pressure sensor 202 and a grinding disc adjuster monitoring module 210 connected to each other. The pressure sensor 202 is used to obtain the actual size of the pressure applied to the grinding disc by the grinding disc regulator, generate a pressure signal and transmit it to the grinding disc regulator monitoring module 210, and the grinding disc regulator monitoring module 210 processes the pressure signal and outputs it to the display Display pressure information.

[0025] In this embodiment, the pressure sensor 202 is arranged on the grinding disc adjuster to detect the actual pressure of the diamond disc on the ...

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Abstract

The invention relates to a monitoring device for a pad conditioner, comprising a pressure sensor and a monitoring module of the pad conditioner in a mutual connection. The pressure sensor is used for acquiring an actual magnitude of a pressure stressed on a pad by the pad conditioner, generating a pressure signal and transmitting the pressure signal to the monitoring module of the pad conditioner; and the monitoring module of the pad conditioner is used for processing the pressure signal and then transmitting the signal to a display for displaying pressure information. The invention further relates to a monitoring method for the pad conditioner. The monitoring device and method for the pad conditioner can acquire and monitor the actual magnitude of the pressure stressed on the pad by the pad conditioner in real time by setting the pressure sensor, thereby enabling the operator to take notice in time when the pressure is abnormal and to conduct an adjustment, avoiding the abandonment of products caused by the abnormal pressure, and reducing the production cost.

Description

【Technical field】 [0001] The invention relates to a semiconductor process, in particular to a monitoring device for a grinding disc adjuster of a wafer grinding device in a CMP process, and also to a monitoring method for a grinding disc adjuster. 【Background technique】 [0002] The pad conditioner is crucial to the process of CMP (Chemical Mechanical Planarization, chemical mechanical planarization). It grinds the pad under pressure through the diamond particles on the surface, which can optimize the The texture of the grinding disc can improve the life of the grinding disc, and at the same time, it can assist the uniform distribution of the grinding liquid on the grinding disc, which has a crucial impact on the grinding rate and uniformity. [0003] figure 1 It is a structural schematic diagram of a traditional wafer grinding equipment, including a grinding disc (Pad) 12, a polishing head (Polishing Head) 14, a spray head 16 and a grinding disc conditioner (Pad Conditione...

Claims

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Application Information

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IPC IPC(8): B24B37/005H01L21/304
Inventor 钱小飞陆铭
Owner CSMC TECH FAB2 CO LTD
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