Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole

An integrated circuit and plastic packaging technology, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of increased thickness of horizontal flash, difficult removal, large spacing, etc., to achieve the effect of convenient removal and increased production efficiency

Inactive Publication Date: 2012-10-17
TONGLING SANJIA YAMADA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the horizontal overflow material thickness of the product is increased and the

Method used

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  • Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole
  • Integrated circuit plastic packaging mold for preventing horizontal overflowed material at cored hole

Examples

Experimental program
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Embodiment Construction

[0013] This example figure 2 As shown, it includes an upper insert seat 1, a lower insert seat 5, an upper forming insert 3 and a lower forming insert 4 and a core 2 which are superimposed between the upper and lower insert seats, the upper forming insert 3 and the lower A core hole 7 is provided in the center of the contact of the molding insert 4, and a stepped through hole 8 is provided on the lower molding insert 4. The core 2 is located in the stepped through hole 8. The bottom surface of the larger diameter end of the stepped through hole 8 is There is a gap between the corresponding surfaces of the core end at the larger end, and a spring 6 is arranged between the bottom surface of the core 2 and the lower insert seat 5 to realize the elastic extrusion of the upper end surface of the core 2 on the upper molding insert of the core hole. Pieces on 3 sides. The preferred form of the spring 6 is a butterfly spring. There is also a gap between the larger diameter end of th...

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PUM

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Abstract

The invention discloses an integrated circuit plastic packaging mold for preventing a horizontal overflowed material at a cored hole. The integrated circuit plastic packaging mold comprises an upper insert seat, a lower insert seat, an upper forming insert, a lower forming insert and a core, wherein the cored hole is formed in the center of a contact position of the upper forming insert and the lower forming insert; a step-shaped through hole is formed in the lower forming insert; the core is positioned in the step-shaped through hole; and the upper end surface of the core is elastically extruded on the surface, with the cored hole, of the upper forming insert. The integrated circuit plastic packaging mold is in a gapless state in a filling process, the thickness of the horizontal overflowed material of a packaged product is not increased, the horizontal overflowed material is convenient to remove, and production efficiency is greatly increased.

Description

Technical field [0001] The invention relates to an integrated circuit plastic packaging mold, especially a packaging mold with a core. Background technique [0002] Integrated circuit plastic packaging molds are widely used in integrated circuit packaging, such as figure 1 As shown, the commonly used integrated circuit plastic packaging mold includes an upper insert seat 1, a lower insert seat 5, an upper molding insert 3, a lower molding insert 4, and a core 2 which are overlapped between the upper and lower insert seats. The center of the contact between the molding insert 3 and the lower molding insert 4 is provided with a core hole 7, and the lower molding insert 4 is provided with a stepped through hole, and the core 2 is located in the stepped through hole to control the core after product packaging For the horizontal flash around the hole, the assembly gap A size between the core 2 and the upper molding insert 3 must be controlled. The smaller the A size, the better, but i...

Claims

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Application Information

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IPC IPC(8): H01L21/56
Inventor 曹杰杨亚萍
Owner TONGLING SANJIA YAMADA TECH
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