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Manufacture procedure for electronic substrate and applied adhesion agent

A technology of electronic substrates and adhesives, which is applied in the process of adhesives, and in the field of adhesives with temperature control characteristics, which can solve problems such as process warpage, assembly errors, and effects on the bonding of materials in various layers.

Active Publication Date: 2012-10-17
ZHEJIANG KUOSEN FINE CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The traditional manufacturing process may cause warpage, which will affect the bonding of the materials of each layer. For precision electronic equipment, it will also cause assembly errors and troubles.

Method used

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  • Manufacture procedure for electronic substrate and applied adhesion agent
  • Manufacture procedure for electronic substrate and applied adhesion agent
  • Manufacture procedure for electronic substrate and applied adhesion agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] (1) The designated representative for this case is as follows: image 3 .

[0026] (2) A brief description of the component symbols in this representative diagram:

[0027] S301 Prepare the first substrate

[0028] S303 Coating liquid adhesive

[0029] S305 Form adhesive dry film

[0030] S307 Bonding the second substrate

[0031] S309 Forming electronic substrates

[0032] S311 Adhesive dry film loses adhesion

[0033] S313 Stripping electronic substrates

[0034] The chemical formula that best shows the characteristics of the invention:

[0035]

[0036] This specification proposes an adhesive, which is applied to the lamination process between different substrate materials in a multi-layer structure. The adhesive especially has temperature control characteristics, and its characteristics can be changed through temperature control. For example, the composition of the adhesive is in It has adhesiveness at high temperature, but it can lose its adhesiveness wh...

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PUM

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Abstract

The invention provides a manufacture procedure for an electronic substrate and an applied adhesion agent, wherein an embodiment of the manufacture procedure for the electronic substrate comprises steps of firstly preparing a first substrate, especially a hard substrate, coating a liquid-state adhesion agent on the substrate, and forming a dry film via temperature rising; then, attaching a second substrate of a different physical characteristic on the first substrate, especially a flexible substrate; Then forming an electronic substrate via a processing procedure; then, making the adhesion agent dry film lose adhesion via temperature lowering or other optical methods, and stripping the electronic substrate; and particularly, the adhesion agent for the adhesion agent dry film formed via temperature rising and the temperature lowering film stripping is a recoverable material.

Description

technical field [0001] This specification proposes a manufacturing process of an electronic substrate and an adhesive used, especially an adhesive with temperature control characteristics, and a manufacturing process using the adhesive. Background technique [0002] With the increasing application of circuit boards and powerful functions, circuit boards with multi-layer structures or structures with laminated multi-layer materials are produced in applications. In the production, there are certain physical differences between the layers. For example, when the materials of each layer are heated, different phenomena will occur due to the difference in the specific heat of the structure and the material on each layer, especially because of the heating or low temperature during the process. The uneven response to temperature creates problems with warping, which prevents the layers from fitting snugly. [0003] Such questions can refer to figure 1 It is a schematic diagram showi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46C09J125/14C09J7/02
Inventor 庄学平王佩瑶陈怡全
Owner ZHEJIANG KUOSEN FINE CHEM TECH