Exposure Alignment Method

Abstract

The invention relates to the mechanical field, in particular to an exposure alignment method. The method is suitable for an exposure machine, and comprises the following steps: A. determining a first position deviation between an upper negative film and a lower negative film according to the positions of the upper negative film and the lower negative film stored in a frame; B. determining movement values of the negative films, and driving one of the upper negative film and the lower negative film based on the other of the upper negative film and the lower negative film according to the movement values of the negative films until the upper negative film is aligned to the lower negative film; C. locking the upper negative film and the lower negative film in position; D. determining a second position deviation between a copper-clad plate and the upper negative film or the lower negative film according to the position of the copper-clad plate placed between the upper negative film and the lower negative film locked in position; and E. determining the movement value of the copper-clad plate according to the second position deviation and driving the copper-clad plate based on the upper negative film or the lower negative film according to the movement value of the copper-clad plate until the copper-clad plate is aligned to the negative films. According to the exposure alignment method, the high-efficiency and accurate alignment for the negative films and the copper-clad plate can be realized.

Description

technical field [0001] The invention relates to the mechanical field, in particular to an exposure alignment method. Background technique [0002] In the (PCB board) manufacturing process, one of the most critical processes is to transfer the negative image to the copper clad foil substrate. In order to connect the wires, the upper and lower graphics of the PCB board must have an accurate positional relationship, and the upper and lower negatives and the PCB board are required to be aligned with each other. Their alignment accuracy and speed determine the production accuracy and efficiency of PCB boards. [0003] In the existing drying racks, there are two PINs for clamping the copper clad board on each drying rack. The alignment system controls the movement of the two PINs in the X and Y directions. When aligning the drying rack, first overlap the upper and lower negatives and the copper-clad board, and then put them on the PIN of the drying rack. The operator uses the m...

AI Technical Summary

Problems solved by technology

The film loading procedure is complex and the alignment accuracy is low

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