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Method for manufacturing circuit substrate with smooth surface

A technology of circuit substrate and smooth surface, which is applied in the field of circuit substrate structure and its manufacturing with smooth surface, and can solve the problems of circuit pattern wear and damage, etc.

Active Publication Date: 2015-02-04
MUTUAL TEK INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the traditional circuit pattern is used to protrude from the surface of the underlying substrate, it is easy to cause the circuit pattern on the substrate structure to wear and damage with long-term use

Method used

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  • Method for manufacturing circuit substrate with smooth surface
  • Method for manufacturing circuit substrate with smooth surface
  • Method for manufacturing circuit substrate with smooth surface

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Embodiment Construction

[0026] Hereinafter, each embodiment is described in detail and examples accompanied by accompanying drawings are used as a reference basis of the present invention. In the drawings or descriptions in the specification, the same reference numerals are used for similar or identical parts. And in the drawings, the shapes or thicknesses of the embodiments may be enlarged, and marked for simplicity or convenience. Furthermore, parts of each element in the drawings will be described separately. It should be noted that the elements not shown or described in the drawings are forms known to those skilled in the art. In addition, specific The examples are only for revealing specific methods used in the present invention, and are not intended to limit the present invention.

[0027] According to the main embodiment and aspect of the present invention, a method for manufacturing a circuit substrate structure is provided, in which a patterned circuit structure is embedded in a prepreg sub...

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Abstract

The invention discloses a method for manufacturing a circuit substrate with a smooth surface. The method for manufacturing the circuit substrate structure comprises the following steps of: providing a carrier; attaching a copper foil to the carrier; forming a photoresist layer on the copper foil and applying a photoetching process on the photoresist layer, so that the surface of the copper foil with circuit patterns is exposed; forming a covering layer on the surface of the copper foil with the circuit patterns; forming a copper coating on the covering layer so as to form a pattern circuit structure; removing the photoresist layer, and exposing the copper foil on the bottom layer; laminating a prepreg and the carrier with the patterned circuit structure to form a stacking body; removing the carrier and the copper foil; and stamping the prepreg to form the circuit substrate with the smooth surface.

Description

technical field [0001] The invention relates to a manufacturing method of a circuit substrate structure, in particular to a circuit substrate structure with a smooth surface and a manufacturing method thereof. Background technique [0002] In advanced electronic assembly technology, printed circuit substrates and modules can effectively increase the unit density of chips on the substrate, shorten the length of conductors connecting chips, reduce the capacitance effect between networks, and improve the performance and reliability of circuits. In the background technology, most of the printed circuit boards are laminated boards made of composite materials, which are first coated with a layer of copper foil, and then etched to obtain the desired printed circuit board. In terms of structure, the circuit pattern is formed by electroplating to protrude from the surface of the underlying substrate. [0003] However, as far as practical application is concerned, the multi-switching...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/24
Inventor 陈秋伃
Owner MUTUAL TEK INDS