Heat sink material

A heat-dissipating, substrate technology, applied in electrolytic coatings, thin material processing, coatings, etc., can solve the problems of shape limitation and difficult correspondence of heat-dissipating materials

Active Publication Date: 2012-10-24
NIPPON PRECISION JEWEL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, in the case of surface treatment with diamond grains by the CVD method, it is necessary to perform the treatment under high temperature conditions, so there may be problems with the heat resistance of the treatment object.
In addition, in the case of press molding, it is necessary to form a mold frame and it is difficult to cope with complex shapes, so the shape of the obtained heat dissipation material will be limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] use Figure 7 The indicated electroplating device (the anode material is an electrolytic nickel plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 1 is prepared according to the operation method described below.

[0068]

[0069] Diamond particles manufactured by Element Six Ltd. with an average particle diameter of 25 μm were dispersed in a nickel plating solution having a composition shown in Table 1 below so that the dispersion amount was 50 g / liter. Set the current density to 8A / dm 2 Then, a plating treatment was performed for 300 minutes to obtain a composite plating film having a predetermined total plating film thickness of 500 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 500rpm to 150rpm, so that the eutectoid density of the diamond particles is gradually increased from the substrate surface side to the film surface side from 0vol...

Embodiment 2

[0073] use Figure 7 The electroplating device shown (the anode material is an electrolytic copper plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 2 is produced according to the operation method described below.

[0074]

[0075] Diamond particles with an average particle diameter of 25 μm manufactured by Element Six Ltd. were dispersed in a copper electroplating solution having a composition shown in Table 2 below so that the dispersion amount was 50 g / liter. Set the current density to 0.1~6A / dm 2 Then, a plating treatment was performed for 540 minutes to obtain a composite plating film having a predetermined total plating film thickness of 500 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 600rpm to 50rpm, so that the eutectoid density of the diamond particles is gradually increased from the substrate surface side to the film surface side fro...

Embodiment 3

[0079] use Figure 7 The electroplating device shown (the anode material is an electrolytic nickel plate) uses a stainless steel plate (20mm×20mm×0.5mm) as a base material, and the heat dissipation material of Example 3 is prepared according to the following operation method.

[0080] Diamond particles with an average particle diameter of 25 μm manufactured by Element Six Ltd were dispersed in a nickel plating solution having a composition shown in Table 3 below so that the dispersion amount was 50 g / liter. Set the current density to 8A / dm 2 Then, a plating treatment was performed for 290 minutes to obtain a composite plating film having a predetermined plating film thickness of 490 μm. During the formation of the composite electroplating film, the stirring speed is gradually changed from 500rpm to 150rpm, so that the eutectoid density of the diamond particles gradually increases from 0vol% to 35vol% from the surface side of the substrate to the surface side of the film. Grad...

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Abstract

Provided is a heat sink material which has excellent heat dissipation properties and in which molded articles having various shapes and comprising various materials can be utilized as the base of the heat sink material. The heat sink material itself has excellent resistance, can be configured so as to have a reduced thickness, and is especially suitable for use as a heat sink material for semiconductor devices especially for cell phones, personal computers, etc. The heat sink material is equipped with a composite deposit formed by electroplating, the composite deposit comprising a metal deposit as a matrix and diamond particles that have been co-deposited in the matrix so that the amount of the co-deposited particles gradually changes in the thickness direction of the metal deposit.

Description

technical field [0001] The present invention relates to heat-dissipating materials, and more specifically to heat-dissipating materials that not only exhibit excellent heat-dissipating properties but also can use molded articles made of various shapes and materials as mobile bodies, especially as It is used as the substrate of heat dissipation materials such as vehicles and automobiles. In addition, it is also excellent in durability as a heat dissipation material, and because it can also be thinned, it is used as a semiconductor device, especially as a mobile phone and In particular, heat-dissipating materials such as personal computers can be preferably used. Background technique [0002] Conventionally, in order to efficiently dissipate the heat generated by the electronic components in the device to the outside during operation, a heat dissipation material is arranged in the device. Diamond is used in such heat-dissipating materials as a substance excellent in heat diss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/02H01L23/373
CPCH01L2924/0002H01L2924/09701C25D15/00H01L23/373H01L23/3736H01L23/3732H01L23/3735Y10T428/12458H01L2924/00
Inventor 仲川和志中村宜弘山本晋也松村宗顺
Owner NIPPON PRECISION JEWEL IND
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