Systems and methods providing arrangements of vias

Abstract

A semiconductor chip (402) includes an array of electrical contacts (412, 413) and multiple vias (416, 417) coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one (412) of the electrical contacts of the array of electrical contacts is coupled to N vias (416), and a second one (413) of the electrical contacts of the array of electrical contacts is coupled to M vias (417a, 417b). M and N are positive integers of different values.

Description

technical field [0001] The present invention relates generally to the arrangement of features in semiconductor circuits, and more particularly to the arrangement of vias. Background technique [0002] figure 1 is an illustration of an exemplary conventional chip package 100 . Chip package 100 includes a wide input / output (I / O) memory chip 101 mounted on top of a logic chip 102 . Chips 101 and 102 are mounted on packaging substrate 104 using, for example, an adhesive. Logic chip 102 is in electrical communication with contacts (not shown) on substrate 102 using wire bonds 105 . [0003] Chips 101 and 102 are shown electrically coupled to each other using ball grid arrays 103 , 106 . Specifically, memory chip 101 includes ball grid array 103 (shown from the side), and logic chip 102 includes ball grid array 106 (also shown from the side). The corresponding BGAs 103 and 106 are aligned with each other and make contact with each other so that the chips 101 and 102 communica...

AI Technical Summary

Problems solved by technology

During production, an underfill (not shown) may be added to the chip package 100 to provide mechanical support to the various components, but the stress around the periphery of the memory chip during production (before the underfill is added) can lead to impacts on the ball grid. Mutual Contact and Alignment Torque of Lattice Arrays 103, 106

As the amount of surface area of ​​the backside of the memory chip 101 not covered by the ball grid array 103 increases, the torque problem also increases.

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