Intelligent dual-interface card and welding packaging process for intelligent dual-interface card
A dual-interface card and process technology, which is applied to record carriers used in machines, instruments, computer parts, etc., can solve the problems of slow speed and difficult quality control, so as to improve the strength of solder joints, improve product output and quality, and improve The effect of production speed
Active Publication Date: 2012-11-21
ESIM TECH LTD
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Problems solved by technology
[0004] One of the technical problems to be solved by the present invention is to provide an intelligent dual-interface card for the technical problems existing in the dual-interface card prepared by the existing manufacturing process of the dual-interface card
[0005] The second technical problem to be solved by the present invention is to provide a smart card for the technical problems of the existing process of manufacturing dual-interface cards, such as thread picking, soldering, welding and packaging, which are all carried out manually, with slow speed and difficult quality control. Soldering and encapsulation process of dual interface card
Method used
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[0057] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the implementation of the present invention will be further described below in conjunction with specific illustrations.
[0058] The intelligent dual-interface card welding and packaging process of the present invention includes the following steps:
[0059] 1. Preparation of the first intermediate card base material step
[0060] see figure 2 and image 3 , take an intermediate card base material 110, draw several card areas 111 on the intermediate card base material 110, each card area 111 is used to prepare a dual-interface card, in each card area 111 a There are two technological small holes 112, 112a punched in side symmetrical intervals; see Figure 4 and Figure 5 , two 113, 113a are punched symmetrically at intervals on one side of each card area 111, and the distance between the two process holes 112, 112a is greater than the dis...
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The invention discloses an intelligent dual-interface card, comprising a card base, an antenna and a chip; a welding point of the antenna is embedded into the card base through a first conduction welding material; the chip is thermally sealed on the card base by an adhesion agent; a pin of the chip is electrically connected with a second conduction welding material embedded into the card base; and the second conduction welding material is electrically connected with the first conduction welding material and then is electrically connected with the antenna. Bottom surfaces of the first conduction welding material and the second conduction welding material are electrically connected together by a conduction connection plate embedded into the card base. The antenna is not picked out to be welded with the pin on the chip, so an antenna breaking problem can be avoided. According to the intelligent dual-interface card, the conduction welding materials filled in process holes are used, so that welding of the antenna, the conduction welding materials and the pin of the chip as well as welding of a chip substrate and the card base can be achieved on same equipment and at a same work station; the welding can be finished by heating the same welding head; therefore, production speed, product yield and quality can be greatly improved.
Description
technical field [0001] The invention relates to the technical field of manufacturing an intelligent dual-interface card, in particular to an intelligent dual-interface card and its welding and packaging process. Background technique [0002] The dual-interface card is a card that combines the functions of a contact IC card and a contactless IC card. Contact IC cards are like telephone cards, which need to be inserted into the telephone before they can be used. A non-contact IC card is like a bus IC card. Its chip and antenna are inside the card. Because of the antenna, when taking a bus, the card can be swiped without contact. The dual-interface card uses one chip for two functions, configures the antenna and connects the antenna to the chip. Dual interface cards can be used on both contact and non-contact implements. [0003] The current manufacturing process of dual-interface cards is: antenna production-lamination-cutting small cards-milling grooves-manual thread picki...
Claims
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Login to View More IPC IPC(8): G06K19/077
CPCG06K19/07754G06K19/077
Inventor 王峻峰张耀华胡细斌王建张骋蒙建福
Owner ESIM TECH LTD