Cooling device and cooling method for wire clamp driving motor of bonding machine, and bonding machine
A technology for driving motors and cooling devices, which is applied in the field of bonding machines, can solve the problems of not being able to meet the flexible and fast response of wire clips, the slow response speed of wire clip driving motors, and reducing the working efficiency of bonding machines, etc., to achieve the expansion of clamping The effect of improving the force range, cooling efficiency, and work efficiency
Inactive Publication Date: 2012-12-05
CETC BEIJING ELECTRONICS EQUIP
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Problems solved by technology
This method has low cooling efficiency, and causes the response speed of the clamp drive motor to slow down, which cannot meet the technical requirements of flexible and fast response of the clamp, and reduces the working efficiency of the bonding machine.
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[0027] The cooling device for the wire clamp driving motor on the bonding machine of the present invention includes a gas introduction device fixed on the bonding machine, the gas introduction device is connected to the gas source through an air intake pipe, and is used for both sides of the motor mover of the wire clamp driving motor The gases for cooling are respectively introduced simultaneously.
[0028] The present invention will be described in further detail below in conjunction with accompanying drawing:
[0029] see image 3 As shown, the wire clamp installed on the bonding machine includes a wire clamp movable arm 4 and a wire clamp fixing arm 16 matched with the wire clamp movable arm 4 . The first wire clip clip 8 is bonded to the wire clip movable arm 4 , the second wire clip clip 18 is bonded to the wire clip fixed arm 16 , and the wire clip fixed arm 16 is connected to the bonding head through a screw 10 . The wire clamp movable arm 4 is connected with the wir...
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The invention provides a cooling device for a wire clamp driving motor of a bonding machine. The cooling device comprises an gas leading device which is fixed on the bonding machine; and the gas leading deice is connected with a gas source through a gas inlet pipe and used for respectively leading cooling gas to two sides of a motor mover of the wire clamp driving motor. A cooling method disclosed by the invention comprises the step of leading the cooling gas to the two sides of the motor mover of the wire clamp driving motor. According to the bonding machine disclosed by the invention, the gas leading device is arranged on the wire clamp fixing arm and used for leading the gas to the two sides of the motor mover of the wire clamp driving motor. The cooling gas is led to the two sides of the motor mover simultaneously, so that the cooling efficiency is largely improved; and due to the increment of the cooling efficiency, the fast response of the wire clamp driving motor for driving a wire clamp is ensured, and the working efficiency of a full-automatic lead bonding machine is improved. According to the bonding machine disclosed by the invention, the cooling device with a high cooling efficiency is arranged in the wire clamp driving motor, so that the working efficiency is largely improved.
Description
technical field [0001] The invention relates to a kind of equipment specially suitable for manufacturing or processing semiconductors, in particular to a cooling device, a cooling method and a bonding machine for a wire clip driving motor on a bonding machine. Background technique [0002] Bonding is a welding process that connects the metallized circuit leads or electrodes on the circuit chip with the metal lead frame or the lead electrode wire of the assembled chip in one-to-one correspondence. As a kind of bonding equipment, the bonding machine guides the metal lead wire (gold wire) to make complex and high-speed movements in three-dimensional space through a ceramic thin tube (hatching knife), forming various wire arcs that meet the needs of different packaging forms. [0003] The bonding machine mainly includes: XY working platform, bonding head, material clamping table, loading and unloading device and other components. During the working process of the bonding machin...
Claims
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Login to View More IPC IPC(8): H02K1/32H02K9/02H01L21/60
CPCH01L24/78H01L2224/78H01L2924/00014H01L2224/48H01L2924/00012
Inventor 李朝军
Owner CETC BEIJING ELECTRONICS EQUIP