Device and method used for cleaning chamber before etching process

Abstract

The invention relates to the technical field of a dry etching process in an array substrate production process and discloses a device used for cleaning a substrate before etching process. The device is a chamber and comprises a chamber body and is used for holding and transmitting the substrate. The invention also provides a method for cleaning the substrate before the etching process. The device designed by the invention can be used for cleaning the inner environment of the chamber before the dry etching, so that the influence possibly caused on the array substrate properties by particle pollution can be removed to a large extent.

Description

technical field [0001] The invention relates to the technical field of dry etching process in the production process of array substrates, in particular to a device and method for cleaning a chamber before the etching process. Background technique [0002] At present, in the TFT field, the size of the glass substrate is getting bigger and bigger, and the corresponding chamber is getting bigger and bigger, so the control of particle pollution is becoming more and more difficult. At the same time, due to the larger size of the unit panel, ultra-high resolution (4000* 2000), the development and application of technologies such as in-cell touch screen and GOA (Gate On Array), the impact of particle pollution on product yield and technology development and design has become increasingly prominent. [0003] In the dry etching process, defects such as disconnection and short circuit caused by particle pollution are the key reasons affecting the final yield of the product, and the co...

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Problems solved by technology

[0005] One of the main reasons for particle pollution is that the reaction products deposited on the inner wall of the chamber fall off due to strong pressure changes in the chamber during the process. In the existing process, the BT step only removes the natural oxide layer on the surface before etching. Pre-treatment, this treatment method cannot effectively optimize the chamber environment, that is, it cannot clean the particle contamination inside the chamber, which shortens the chamber maintenance cycle, reduces the fault tolerance of the production line, and may cause product damage caused by particle contamination. bad

Existing cleaning devices are often specially designed additional cleaning equipment, which increases additional material consumption costs and increases cleaning costs

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