Sectional pin for semiconductor coating equipment

A coating equipment and segmented technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high processing cost, difficult installation, complex structure, etc., and meet the requirements of low price, simple structure, and precision not high effect

Active Publication Date: 2012-12-12
PIOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a relatively simple structure and a new type of split structure pin with good performance in view of the technical problems of the above-mentioned prior art with complex structure, high processing cost and difficult installation.

Method used

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  • Sectional pin for semiconductor coating equipment
  • Sectional pin for semiconductor coating equipment
  • Sectional pin for semiconductor coating equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0012] refer to Figure 1-3 , a segmented pin for semiconductor coating equipment, the segmented pin is composed of an upper part 1 and a lower part 2 of the pin. The upper part 1 of the pin and the lower part 2 of the pin are connected by an external thread 8 and an internal thread 12 respectively. The upper end of the upper part 1 of the pin adopts a conical surface 4, and the top end is shaped on a spherical surface 3.

[0013] After the upper part 1 of the pin is connected with the lower part 2 of the pin, in order to ensure the overall performance of the entire pin, the outer surface A5 and the outer surface B15 of the two need to reach a certain straightness. In order to ensure the straightness between the two parts, it is required that the final contact surface A6 and contact surface B10 of the pin upper part 1 and the pin lower part 2 maintain a certain degree of perpendicularity with their outer surface A5 and outer surface B15 respectively, and be in coincidence aft...

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PUM

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Abstract

The invention relates to a sectional pin for semiconductor coating equipment, which mainly solves the technical problems that the sectional pin for the semiconductor coating equipment in the prior art is complex in structure, high in machining cost and large in installation difficulty. The sectional pin for the semiconductor coating equipment consists of an upper part of a pin and a lower part of the pin. The upper part of the pin is made of ceramic, and an external screw thread is prepared outside the upper part of the pin. The lower part of the pin is made of nickel, and an internal screw thread is prepared inside the lower part of the pin. The upper part and the lower part of the pin are connected through the inner and outer screw threads. The sectional pin at least consists of two sections which are connected by screw threads or pins to form an integral pin. The sectional pin for the semiconductor coating equipment has the beneficial effects that the structure can realize performance requirement in a wafer transmission process of the pin, and the sectional pin for the semiconductor coating equipment is more reasonable compared with the prior art, has less requirement on precision of parts, is simple in structure, is not provided with a complex guiding structure or counter weight structure, and is convenient to machine and install, and the cost is relatively low.

Description

technical field [0001] The invention relates to a segmented pin for semiconductor coating equipment, specifically a new type of segmented pin whose structure can realize the connection of two or more pins of different materials through threads or other methods, and belongs to the semiconductor thin film deposition Application and preparation technology field. Background technique [0002] In the existing semiconductor coating equipment, especially in the 12-inch semiconductor coating equipment, various forms of pins (Pins) for supporting and lifting the wafer are used. However, the requirements for the pins are consistent, that is, during the transfer process of the wafer, the lifting and lowering is smooth, without any abnormal phenomena such as tilting and stagnation, so as to support the wafer well and ensure that the entire wafer is transported without any problems. Abnormal phenomena such as sliding discs appear and the pin can fall and rise normally. Since its workin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687
Inventor 凌复华吴凤丽国建花
Owner PIOTECH CO LTD
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