HCT slicer precision adjusting method

Abstract

The invention discloses an HCT slicer precision adjusting method, and relates to the technical field of slicing of solar silicon wafers. The HCT slicer precision adjusting method includes reversing the movement direction of a wire net when the proportion of rejects with uneven thicknesses and notches is higher than 2.5%. Particularly, the process of reversing the movement direction of the wire net includes adjusting the original wire inlet end as a wire outlet end and adjusting the original wire outlet end as a wire inlet end, so that affection to thicknesses of the wafers due to steel wire abrasion is consistent with a compensation value of the guide pulley groove pitch. The HCT slicer precision adjusting method has the advantages that since wire inlet and wire outlet directions of steel wires are adjusted by changing the original wire inlet end into the wire outlet end and changing the original wire outlet end into the wire inlet end, the steel wires with high sand carrying capacity and optimal sand carrying quantity are placed on a front bearing box (with slightly poor precision), and the abraded steel wires are placed on a back bearing box (with high precision), accumulative effects caused by various adverse factors are balanced, the slicing yield is increased, the proportion of reject silicon wafers with the uneven thicknesses and the notches can be reduced effectively, and the reject rate is decreased by 0.3-0.7% integrally.

Description

technical field [0001] The present invention relates to the technical field of solar silicon wafer cutting, especially to improve the problem that the ratio of defective silicon wafers increases due to the difference in equipment accuracy on both sides of the guide wheel (the front bearing box side and the rear bearing box side) and the cumulative factors of different steel wire wear in HCT slicers. The problem relates to a method for improving the yield rate of slicing. Background technique [0002] In the silicon wafer manufacturing process, the increase in the yield rate of slices is an important factor to enhance self-core competitiveness. The bearing box of HCT wire saw is divided into front bearing box: Front Bearing Box (free bearing box) and rear bearing box: Rear Bearing Box (fix bearing box). Every time the HCT slicer replaces the guide wheel, the front bearing box needs to be disassembled, and the rear bearing box is fixed. During the slicing process, the mortar...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a precision adjustment method for HCT slicer, which is used to improve the HCT slicer due to the difference in equipment precision on both sides of the guide wheel (the front bearing box side and the rear bearing box side) and the cumulative factors of different steel wire wear. The problem of increasing the proportion of silicon wafers, thereby improving the yield of slicers