Application method of micropore flat plate and preparation method of micropore glass

Abstract

The invention discloses an application method of a micropore flat plate, which is used for steel wire cutting of a target silicon block in a slicer, two opposite surfaces of the micropore flat plate are respectively bonded with a tray and the silicon block with an adhesive, at least the surface of the micropore flat plate, which is bonded with the silicon block, is in a micropore structure, and alternation between peaks and valleys is more obvious on the rough surface of the micropore structure. In the process of slicing, by using the micropore structure, a steel wire net is stabilized, and the silicon block is fixed. After slicing, by using the micropore structure, the bonded layer is easy to soften, a silicon wafer is easily disconnected from the micropore flat plate, the rejection rate of the edge of the bonded surface in the process of wire cutting of the silicon wafer is controlled to be less than 5%, and the yield rate of slices is increased. In addition, the invention further discloses a preparation method of micropore glass.

Description

technical field [0001] The invention relates to the field of silicon block processing, in particular to an application method of a microporous flat plate and a preparation method of microporous glass. Background technique [0002] At present, in the silicon block slicing process in the field of solar energy, the silicon block fixing devices are tray sandblasted glass and silicon block from top to bottom. One side of the sandblasted glass is glued to the tray and the other side is glued to the target silicon block. Specifically, the silicon block cutting operation is that the silicon block fixing device moves vertically downward, the steel wire moves horizontally and cuts the silicon block, and then the silicon block wire is cut into silicon wafers. In the later stage of cutting the silicon block, the steel wire forms a wire bow due to the downward pressure of the silicon block, so that the middle section of the silicon block is not completely cut through, but the two edges ...

AI Technical Summary

Problems solved by technology

However, since the sandblasted glass is relatively flat and the adhesive layer is thick, it is difficult for the debonding agent to penetrate into the sandblasted glass and the silicon wafer, so that it is difficult to react with the adhesive layer sandwiched between the sandblasted glass and the silicon wafer, resulting in sticking. The adhesive layer is not easy to soften, and it is difficult to separate the silicon wafer from the sandblasted glass, and the residual adhesive layer needs to be wiped repeatedly with a scouring pad, which can also easily lead to poor edges of the silicon wafer, resulting in edge chipping, chipped corners, silicon falling, hidden Crack defects reduce the quality of silicon wafers

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