Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure

A PCB board and embedded technology, which is applied in the field of mobile communication terminals, embedded PCB board structure and its processing, can solve the problems affecting the thickness of smart products, and achieve the effect of reducing the thickness of the whole machine
CN102833947AInactive Publication Date: 2012-12-19HUIZHOU TCL MOBILE COMM CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
HUIZHOU TCL MOBILE COMM CO LTD
Publication Date
2012-12-19
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a mobile communication terminal, an embedded PCB (printed circuit board) structure and a processing method of the embedded PCB structure. The processing method of the embedded PCB structure includes steps of setting a groove used for embedding a device on a PCB with a plurality of PCB sublayers, and embedding a welding plate used for welding the device on the inner layer of the groove. By taking the PCB of smart products as research objects, a large chip limited by height is embedded in the PCB, and the integral thickness of the mobile communication terminal is reduced.
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Description

technical field

[0001] The invention relates to the field of PCB structure, in particular to a mobile communication terminal, an embedded PCB structure and a processing method thereof. Background technique

[0002] With the widespread application of smart products such as mobile phones, the competition among smart product manufacturers is becoming more and more fierce. Each manufacturer will launch several products with different characteristics every year, and the thickness of the product has become a selling point for various manufacturers to promote. Taking mobile phones as an example, the thickness of mobile phones has gradually become thinner, and has reached a thickness of 10mm or less. However, due to the limitations of the motherboard and device thickness, it is very difficult to further reduce the thickness. On the other hand, the thickness is small. Advanced devices are expensive, and some ultra-thin technologies are only mastered by a few manufacturers, all of whi...

Claims

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