Manufacture method of semiconductor device
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as indeterminacy, and achieve the effects of preventing the introduction of thermal strain, high reliability, and prolonging failure life.
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[0064] The embodiments are explained in the following examples.
[0065]
[0066] Figure 1 ~ Figure 6 This is a method of manufacturing a semiconductor device according to an embodiment of the present invention, and is a cross-sectional view of the main part of the manufacturing process shown in terms of process steps. The semiconductor device is, for example, a power module in which an IGBT chip and a diode are connected in anti-parallel.
[0067] First, like figure 1 As shown, the back electrode 6 of the semiconductor chip 5 is fixed with the bonding material 8 on the conductive pattern 4a of the conductive patterned insulating substrate 3 fixed on the heat dissipation base plate 1 by the bonding material 2. In addition, an external lead-out terminal 9 is fixed to the conductive pattern 4b. This member composed of the heat dissipation base plate 1, the insulating substrate 3 with a conductive pattern, the semiconductor chip 5, and the external lead-out terminal 9 is referred ...
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