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Intelligent card module with coil as well as realization method thereof

A smart card and coil technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of high production cost and material cost, complex production process of dual-interface smart cards, etc., and achieve reduced raw material costs, stable performance, and strong reliability Effect

Inactive Publication Date: 2012-12-26
SHANGHAI CHANGFENG SMART CARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing dual-interface smart card production process is relatively complicated. It needs to produce smart card modules first, and then add external coils. The production cost and material cost are relatively high.

Method used

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  • Intelligent card module with coil as well as realization method thereof
  • Intelligent card module with coil as well as realization method thereof
  • Intelligent card module with coil as well as realization method thereof

Examples

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Embodiment Construction

[0042] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0043] The present invention aims at problems such as high energy consumption, cumbersome manufacturing process and relatively poor reliability in use in the conventional production process of the existing smart card, and the implementation of the technical solution provided is as follows:

[0044] see figure 1 with Figure 4 , the smart card module with a coil provided by the present invention, which includes a chip 1, a carrier tape 2 and corresponding molded bodies 10, 11 (such as Figure 5 with 6 ).

[0045] In order to make the module have both contact and non-contact functions, the present invention can choose a double-interface chip or a packaged semiconductor device when selecting a chip.

[0046] The carrier tape 2 is used to carry ...

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Abstract

The invention discloses an intelligent card module with a coil as well as the realization method thereof. The intelligent card module comprises the coil, wherein the coil is arranged in a carrier tape; a chip is a dual-interface chip, and is mounted on the carrier tape and matched with the coil; and the chip and the carrier tape are packaged into the module by a molding body. In the realization method, the intelligent card module is formed in a way of molding and packaging, flip chip bonding or surface mounting. The intelligent card can be directly used in a contact environment and a non-contact environment.

Description

technical field [0001] The invention relates to a microelectronic semiconductor packaging technology and an integrated circuit packaging technology, in particular to a dual-interface smart card module and a corresponding implementation. Background technique [0002] With the continuous progress of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. For the continuous emergence of new application requirements, integrated circuit packaging companies are required to design new types of carrier tapes to meet the new requirements. [0003] For example, in the field of smart card packaging, especially the use of dual-interface smart cards is very large. At present, the smart card industry is developing towards the route of technological innovation. New technologies are constantly emerging, new functions are increasing, and many old functions are constantly being impro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L25/065H01L21/60
CPCH01L2224/73265H01L2224/16225H01L2224/48227H01L2224/32225H01L2924/30107H01L24/73H01L2924/00012H01L2924/00
Inventor 杨辉峰蒋晓兰唐荣烨马文耀
Owner SHANGHAI CHANGFENG SMART CARD
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