Exposure method and exposure device
An exposure method and an exposure area technology, which are applied in the direction of photolithography exposure device, microlithography exposure equipment, etc., can solve the problems of long manufacturing cycle, high material cost, and angular difference of the filter layer, etc., and achieve the goal of reducing the angular difference Effect
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[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0054] The exposure method of the first embodiment of the present invention, such as figure 2 shown, including:
[0055] placing the substrate under the mask plate, and the substrate is parallel to the mask plate, wherein the substrate includes a transparent base and a photoresist coated on the transparent base;
[0056] Use at least two exposure rays to expose the photoresist through the mask plate; wherein, at least two exposure rays pass through the same ...
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