Apparatus and method for treating substrate

Abstract

Provided are an apparatus and method for treating a substrate, and more particularly, to an apparatus and method for treating a substrate using a supercritical fluid. The apparatus for treating a substrate includes a process chamber in which an organic solvent remaining on a substrate is dissolved using a fluid provided as a supercritical fluid to dry the substrate and a recycling unit in which the organic solvent is separated from the fluid discharged from the process chamber to recycle the fluid.

Description

technical field [0001] The invention disclosed herein relates to apparatus and methods for processing substrates, and more particularly, to apparatus and methods for processing substrates using supercritical fluids. Background technique [0002] Semiconductor devices are manufactured through various processes including a photolithography process for forming circuit patterns on a substrate such as a silicon wafer. When manufacturing semiconductor devices, various foreign substances such as fine particles, organic pollutants, metal impurities, and the like may be generated. Foreign substances can cause substrate defects and have a direct adverse effect on the yield of semiconductor devices. Thus, it may be necessary to include a cleaning process for removing impurities in the semiconductor manufacturing process. [0003] Generally speaking, in a typical cleaning process, foreign substances remaining on the substrate are removed with detergent, and then the substrate is clean...

AI Technical Summary

Problems solved by technology

However, in the case of semiconductor devices with fine circuit patterns, the drying process may have low efficiency

In addition, the drying process is not suitable for semiconductor devices having a line width of about 30 nm or less due to damage of the circuit pattern, that is, pattern collapse that often occurs in the drying process.

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