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Method for improving heat resistance of soft resin

A soft resin and heat-resistant technology, which is applied in the field of polymer material preparation, can solve the problems of long preparation process, achieve broad application prospects, solve drying problems, and increase heat-resistant temperature

Active Publication Date: 2014-07-02
BOLIER CHEM YANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

U.S. Patent No. 4,463,032 uses resin with a higher Tg point to suspend and disperse on the surface of soft resin particles to prevent softening and agglomeration. Although it can prevent softening and agglomeration, a new resin component is introduced, which is harmful to the original The performance of the resin will be affected to varying degrees; and the preparation process will go through three steps: soft resin preparation, hard resin preparation, and soft resin wrapping hard resin. The preparation process is long and the whole process takes more than 10 hours.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The existing suspension polymerization process is used to prepare the binary copolymer resin of methyl methacrylate (15%) and n-butyl methacrylate (85%) with a Tg point of 30°C. ℃), add 1.5% palmitic acid (melting point: 63 ℃) whose mass is the total mass of methyl methacrylate and n-butyl methacrylate, keep warm and stir for 40 minutes, cool down and discharge, wash and dry to obtain this product Invention said soft resin.

[0019] According to the heat-resistant test of the oven constant temperature method, the heat-resistant temperature reaches 45°C, which is 15°C higher than that before adding the wrapping material.

[0020] The coating viscosity measured with the resin solution of 30% solid content prepared by dissolving xylene to the binary copolymer resin after the wrapping treatment is 38.01s, while the viscosity measured for the unwrapped binary copolymer resin solution of the same solvent and solid content is The coating viscosity is 37.97s; it can be seen th...

Embodiment 2

[0022] The binary copolymer resin of styrene (27%) and methyl acrylate (73%) with a Tg point of 28°C was prepared by the existing suspension polymerization process. Stearic acid (melting point is 66 ℃) of 0.85% of the total mass of styrene and methyl acrylate, heat preservation and stirring for 30 minutes, cooling and discharging, washing, drying, to obtain the soft resin of the present invention.

[0023] According to the heat-resistant test of the oven constant temperature method, the heat-resistant temperature reaches 44°C, which is 16°C higher than that before adding the wrapping material.

[0024] The coating viscosity measured by the resin solution of 30% solid content prepared by dissolving xylene to the binary copolymer resin after the wrapping treatment is 30.18s, while the viscosity measured by the unwrapped binary copolymer resin solution of the same solvent and solid content is The coating viscosity is 30.30s; it can be seen that the use of the wrapping treatment t...

Embodiment 3

[0026] The terpolymer resin of methyl methacrylate (20%), isobutyl methacrylate (60%) and lauryl methacrylate (20%) with a Tg point of 25°C was prepared by the existing suspension polymerization process , in the heat preservation stage (90-95°C) in the later stage of polymerization, add 1.3% paraffin wax (melting point is 80°C) with a mass of methyl methacrylate, isobutyl methacrylate and lauryl methacrylate total mass, After insulated and stirred for 30 minutes, the temperature was lowered and the material was discharged, washed and dried to obtain the soft resin of the present invention.

[0027] According to the heat-resistant test of the oven constant temperature method, the heat-resistant temperature reaches 42°C, which is 17°C higher than that before adding the wrapping material.

[0028] The coating viscosity measured by the resin solution of 30% solid content prepared by dissolving xylene to the binary copolymer resin after the wrapping treatment is 20.57s, while the v...

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Abstract

The invention discloses a method for improving heat resistance of a soft resin, which is implemented by adding an organic wrapping material with the melting point of 50-99 DEG C is added at the holding stage in the later polymerization reaction period of the soft resin preparation process. Compared with the prior art, the method disclosed by the invention is simple and easy to implement, and can enhance the heat resistance temperature of the prepared soft resin by more than 10 DEG C without adding new equipment or greatly changing the original preparation technique. The wrapping material and the solvent in the resin application process are homologs and have low consumption, and therefore, can not influence the original working properties of the resin, thereby overcoming the problems of storage and transportation of the soft resin in a heat-temperature environment in summer, and solving the problem of drying in the preparation process. Therefore, the invention has very high practical value and very wide application prospects.

Description

technical field [0001] The invention relates to a method for improving the heat resistance of soft resin, which belongs to the technical field of polymer material preparation. Background technique [0002] Glass transition temperature (Tg) is the temperature at which a solid resin changes from a glass state to a rubber state. Generally, the solid resin whose Tg point is below 40°C is called soft resin; the solid resin whose Tg point is above 40°C is called hard resin. Soft resin will soften and agglomerate at a temperature above the Tg point, which will cause great difficulties in drying during the preparation process: if the drying temperature is high, softening and agglomeration will occur; if the temperature is low, the drying time will be long, affecting Preparation efficiency. At the same time, soft resin is easy to soften and agglomerate when stored and transported in high temperature environment in summer. At present, a wrapping material with a higher melting point...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J3/00C08F2/18
Inventor 张海泉吴建军周金林姜笃兵
Owner BOLIER CHEM YANGZHOU