Epitaxial wafer including nitride-based semiconductor layers
A nitride-based, epitaxial wafer technology, applied in the field of epitaxial wafers, can solve the problems of reduced edge dislocation density, cracks, and no crystallinity improvement effect, and achieve the effect of reducing the edge dislocation density
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[0039] figure 1 is a schematic cross-sectional view of an epitaxial wafer applied to a heterojunction field effect transistor showing the first embodiment of the present invention.
[0040] In the production of this wafer, a Si substrate 1 with a diameter of 4 inches was used as the substrate. Before the crystal growth of the nitride-based semiconductor layer, the surface oxide film of the Si substrate 1 is removed by a hydrofluoric acid-based etchant, and then the substrate is set in a chamber of an MOCVD (Metal Organic Chemical Vapor Deposition) apparatus.
[0041] The substrate was heated to 1100° C. in the MOCVD apparatus, and the surface of the substrate was cleaned in a hydrogen environment with a pressure of 13.3 kPa in the chamber.
[0042] Afterwards, by maintaining the substrate temperature and chamber pressure, and flowing NH 3 (12.5slm), the surface of the Si substrate is nitrided. Next, at TMA (trimethylaluminum) flow = 117 μmol / min and NH 3 Under the conditi...
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