Stamping device system
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KITAGAWA SEIKI
- Publication Date
- 2016-03-16
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a press device system provided with a heating press device for heating and pressing a workpiece under vacuum in a vacuum chamber. Background technique
[0002] As a method of manufacturing an electronic circuit board, there is a method of using a heated press device in which a workpiece formed by alternately laminating resin sheets such as prepreg sheets and copper foil is pressed between hot plates. At this time, since the time required for hot stamping is several times longer than the formation (assembly) time for forming a workpiece based on lamination, the hot stamping device is described in Japanese Patent Application Laid-Open Publication JP2002-316296A (hereinafter referred to as the patent document). As described in 1), multiple workpieces can be punched at once using a multi-stage press device in which a plurality of hot plates are arranged in the vertical direction, and the workpieces can be formed efficiently...