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Sealing part of piezoelectric vibration device and piezoelectric vibration device

A sealing component, piezoelectric vibration technology, applied in the direction of electrical components, power oscillators, impedance networks, etc.

Inactive Publication Date: 2016-03-30
DAISHINKU CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the external terminals formed along the outer periphery of the flat surface of the other main surface and the inspection terminals are connected by the conductive bonding material, resulting in a short circuit between the external terminals and the inspection terminals.

Method used

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  • Sealing part of piezoelectric vibration device and piezoelectric vibration device
  • Sealing part of piezoelectric vibration device and piezoelectric vibration device
  • Sealing part of piezoelectric vibration device and piezoelectric vibration device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0048] In crystal oscillator 1 according to this embodiment, as figure 1 , 2 As shown, there are provided: a crystal resonator piece 2 (piezoelectric vibrating piece) for performing piezoelectric vibration; a single-chip integrated circuit element constituting an oscillating circuit together with the crystal resonator piece 2, that is, an IC chip 3 (electronic device element); A base 4 (sealing member) for holding and loading these crystal resonator pieces 2 and IC chips 3, and hermetically sealing the crystal resonator pieces 2 and IC chips 3; The cover 6 (sealing member) hermetically seals the crystal resonator chip 2 and the IC chip 3 held and mounted on the chassis 4 .

[0049] In this crystal oscillator 1 , the base 4 and the cover 6 constitute a package, and the base 4 and the cover 6 are bonded with a bonding material (not shown) to form a hermetically sealed internal space 11 . In this internal space 11 , electromechanical ultrasonic bonding is realized between the I...

Embodiment approach 2

[0091] Next, the crystal oscillator 1 according to the second embodiment will be described with reference to the drawings. Among them, the base 4 of the crystal oscillator 1 according to the second embodiment is different from that of the first embodiment. The effect produced by the same structure and its modifications are the same as those of the first embodiment above. Therefore, in the second embodiment, the structure of the base 4 that is different from the first embodiment described above will be described, and the description of the same structure will be omitted.

[0092] like Figure 5-8 As shown, on the chassis 4, as the electrodes 5, a pair of electrode pads 511 and 512 are formed that are respectively electromechanically bonded to the excitation electrodes 24 of the crystal resonator sheet 2; Connection pads 521, 522, 523, 524, 525, 526; external terminals 531, 532, 533, 534 electrically connected to external devices such as an external circuit board (not shown) t...

Embodiment approach 3

[0100] Next, the crystal oscillator 1 according to the third embodiment will be described with reference to the drawings. The crystal oscillator 1 according to the third embodiment is different from the first embodiment above in that the base 4 is different. The functions and effects produced by the same structure and the modifications thereof are the same as those of the first embodiment above. Therefore, in the third embodiment, the structure of the base 4 that is different from that of the first embodiment will be described, and the description of the same structure will be omitted.

[0101] like Figures 9 to 12 As shown, on the chassis 4, as the electrodes 5, a pair of electrode pads 511, 512 respectively electromechanically bonded to the excitation electrodes 24 of the crystal resonator sheet 2; Pads 521, 522, 523, 524, 525, 526; external terminals 531, 532, 533, 534 electrically connected to external devices such as external circuit boards (not shown) with conductive ...

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PUM

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Abstract

The invention provides a sealing part of a piezoelectric vibration device and a piezoelectric vibration device. The vibration region of the piezoelectric vibrating piece of the piezoelectric vibrating device is hermetically sealed by a plurality of the sealing members in which a convex portion is formed on one main surface of a base material constituting the sealing member. On the other main surface of the base material, a region corresponding to the protrusion is a flat surface, and a region other than the flat surface is a curved surface. In addition, in the sealing member, a plurality of external terminals for connecting to an external circuit board are formed on the flat surface; and a plurality of inspection terminals for inspecting the piezoelectric vibrating reed are formed on the curved surface.

Description

technical field [0001] The invention relates to a sealing part of a piezoelectric vibration device and a piezoelectric vibration device. Background technique [0002] A piezoelectric vibration device is a device in which an excitation electrode of a piezoelectric vibration piece that performs piezoelectric vibration is hermetically sealed, and includes, for example, a crystal oscillator. [0003] The package body of the crystal oscillator is composed of a base of a box-shaped body made of ceramic material, and a cover formed of a solid plate made of metal material. In the inner space of the package, the piezoelectric vibrating reed and the IC chip are bonded and held on the base. Furthermore, since the base and the lid are bonded, the piezoelectric vibrating reed and the IC chip in the internal space of the package are hermetically sealed (for example, refer to Patent Document 1). [0004] In the crystal oscillator disclosed in Patent Document 1, a base obtained by laminat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/02H03B5/32H10N30/88
CPCH03H9/0542H03H9/1014
Inventor 古城琢也森口健二松尾龙二花木哲也
Owner DAISHINKU CORP