Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method for assessing filling performance of different prepregs

A prepreg, porosity technology, applied in the field of circuit board manufacturing, can solve the problems of low evaluation accuracy, low evaluation efficiency, cumbersome evaluation method process, etc., and achieve the effect of ensuring evaluation quality, accurate hole filling, and avoiding quality defects.

Active Publication Date: 2013-02-13
GUANGDONG SHENGYI SCI TECH
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a method for evaluating the hole-filling properties of different prepregs, so as to solve the problems of cumbersome process, low evaluation efficiency and low evaluation accuracy of the current evaluation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for assessing filling performance of different prepregs
  • Method for assessing filling performance of different prepregs
  • Method for assessing filling performance of different prepregs

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0035] see Figure 1 to Figure 3 As shown, for the method of evaluating the hole filling properties of different prepregs in the prior art, such as in the article "Research and Discussion on the Method of Hole Filling Performance of Prepregs" published by Wang Lifeng of Guangdong Shengyi Technology Co., Ltd. on September 22, 2009 The disclosed scheme, according to its production process: drilling → Desmear → copper immersion → browning → drying → lamination, that is, by selecting a core board 11 of suitable material, and then opening different depths, different hole densities and 14 arrays of blind holes with different apertures, such as figure 1 and figure 2 Shown; After the drilling is finished, then is the Desmear process, which uses high-pressure water to rinse the dirt inside and outside the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for assessing filling performance of different prepregs. The method includes the steps of a, selecting cores with a plurality of thicknesses, arranging through hole arrays with different specifications on the cores, and arranging the centre distance of hole centers to be equal in the range of through hole arrays with the same specification; b, preparing a plurality of kinds of prepregs to be assessed, overlapping the prepregs with the cores to form an overlapping body, and attaching release liners; c, positioning the overlapping body in a laminating machine to be subjected to hot pressing; d, taking out the cores and tearing off the liners; and e, assessing the filling effect. The method is characterized in that by arranging the centre distance of hole centers to be equal in the through hole arrays, the evenness of filling can be effectively guaranteed, and further the filling performance of different prepregs can be accurately assessed. Besides, when an assessing sample in produced, procedures required after core drilling, such as desmear, plated through hole and oxidation can be reduced, working procedures are simplified, and quality defects due to the working procedures can be avoided, and assessing quality can be effectively guaranteed.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for evaluating the hole-filling properties of different prepregs. Background technique [0002] At present, in the PCB manufacturing industry, because ink filling holes is more likely to produce quality defects such as voids and dents, and the equipment required for ink filling holes is relatively expensive, some PCB board manufacturers have begun to use prepreg to fill holes. Hole quality defect, but also use the prepreg to fill the hole to reduce the process, thereby reducing the production cost of the enterprise. However, the industry has not yet established a better evaluation method for filling holes with different prepregs. The current common practice is to set the evaluation area on the core board, and then open the number of drilling holes according to the area of ​​the evaluation area, but Such a setting does not take into account the characteristics ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01N33/00
Inventor 王立峰吴小连方东炜
Owner GUANGDONG SHENGYI SCI TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com