Preparation method of ultra-micropore printed board pore-plugging resin
A printed board, ultra-micro hole technology, applied in the direction of the formation of electrical connection of printing elements, can solve the problems of high viscosity of plugging resin, difficult to print, unsatisfactory plugging, etc., to improve the working temperature, improve plugging ability, improve The effect of product quality
Inactive Publication Date: 2013-02-13
DALIAN PACIFIC ELECTRONICS
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Problems solved by technology
However, due to the characteristics of the resin itself used in this process, it is necessary to overcome the difficulties of plugging resin with high viscosity and difficult printing.
When some high-rise thick boards have ultra-micro holes (less than 0.5mm in diameter) that require resin plug holes, problems such as plug hole dissatisfaction and resin sag are prone to occur, resulting in quality defects of printed boards
Method used
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[0014] The present invention will be further described below in conjunction with accompanying drawing:
[0015] Such as figure 1 As shown, the water bath device mainly includes a water bath box 1, a heater 2, a partition 3 and a temperature probe 4, the heater 2 is placed on the bottom panel of the water bath box 1, and the partition 3 is fixed on On the two side panels of the water bath box 1, a round hole with a diameter slightly larger than the diameter of the special beaker 5 is opened on the upper panel of the water bath box 1, and the special beaker 5 is placed on the partition 3 through the round hole ; The upper panel of the water bath box 1 and the partition 3 are respectively provided with round holes slightly larger than the diameter of the temperature probe 4, and the temperature probe 4 is inserted into the bottom panel of the water bath box 1 through these two round holes respectively . The specific working process is as follows: the first step, pour water into...
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The invention relates to a preparation method of pore-plugging resin. A preparation method of ultra-micropore printed board pore-plugging resin comprises the following steps: a, filling water into a water-bath box body till water level is 50-60mm higher than a clapboard, then starting a heating device and setting the temperature in a range of 30-40 DEG C; b, measuring temperature inside the water-bath box body by adopting a temperature probe, after the temperature reaches a set value, pouring the pore-plugging resin into a special beaker, and placing the special beaker onto the clapboard to be heated; c, controlling the heating time to be 20-30 minutes, then evenly stirring by a glass rod for 2-5 minutes; and d, after stirring, standing for 10-15 minutes, then coating the pore-plugging resin heated in the special beaker on a prepared printing screen, and starting printing work. The preparation method of the ultra-micropore printed board pore-plugging resin heats through the water-bath device, improves working temperature of the pore-plugging resin, lowers viscosity of the pore-plugging resin, greatly improves pore-plugging capability of ultra-micropore printed boards, and improves product quality.
Description
technical field [0001] The present invention relates to a method for preparing hole plugging resin, more specifically, to a method for preparing hole plugging resin for ultramicroporous printed boards. Background technique [0002] With the development of electronic information technology, electronic products are developing in the direction of light weight, miniaturization, and high speed, which puts forward higher requirements for printed boards. In the era of high-density connection (HDI) technology, line width and line spacing will be There is an inevitable trend towards smaller and denser. In order to adapt to this development trend, printed circuit board designers and manufacturers are constantly updating design concepts and manufacturing methods. The process of resin plugging is also a technical method invented by people to reduce the design size of printed boards and cooperate with assembly components. Its bold design concept and scalable production have indeed exer...
Claims
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IPC IPC(8): H05K3/40
Inventor 崔连旺牛凯曲键
Owner DALIAN PACIFIC ELECTRONICS