Improved structure for lower sand opening of grinding disc of sheet grinding machine

Abstract

The invention provides an improved structure for a lower sand opening of a grinding disc of a sheet grinding machine. The lower sand opening is a through hole vertical to the horizontal plane and is positioned in a grinding disc base body of an upper grinding disc of the grinding disc, the upper grinding disc also comprises a grinding disc surface which is positioned under the grinding disc base body and is tightly pasted with the lower surface of the grinding disc base body, a disc groove vertical to the horizontal plane is penetrated inside the grinding disc surface, the lower sand opening is in a conical shape, in addition, the inner diameter near the position of the grinding disc surface is smaller than the inner diameter far away from the position of the grinding disc surface, the inner diameter at the pasting part of the lower sand opening and the grinding surface is identical to the width of the disc groove, and the lower sand opening is right against the disc groove. The improved structure has the beneficial effects that the easily broken position of the original grinding disc surface is reinforced through the grinding disc base body, the hidden trouble of the quality is prevented, the service life is prolonged, and the advantages of simple structure, low processing cost and the like are realized.

Description

technical field [0001] The invention belongs to the field of main abrasive tool workpieces of grinding equipment for producing single crystal silicon wafers, and in particular relates to an improved structure of the lower sand port of the grinding disc of the grinding machine. Background technique [0002] In recent years, due to the rapid development of the electronics industry and the diversification of product demand, the initial raw material wafers for electronic products have also been improved, and the technical parameters of the silicon wafer itself, such as surface roughness Ra / Rz, TTV, warp And so on, the requirements for silicon wafers are getting higher and higher. In addition, the cost of raw and auxiliary materials used for silicon wafer processing and production is increasing with the development of the market. The consumption of grinding discs is one of the main parts of production costs. In order to maximize production efficiency and reduce production costs, ...

AI Technical Summary

Problems solved by technology

[0003] Grinding discs are consumables, and their real service life is a value that appears randomly. It is very difficult to control during production. After a period of grinding, the thickness of the grinding disc surface with disc grooves continues to decrease. When the joint position is ground to very thin, because the grinding disc surface at the lower sand hole is not supported by the grinding disc matrix, the grinding disc surface is easy to break, and there are quality problems

In order to prevent quality hazards, the use of still usable grinding discs needs to be stopped early, resulting in waste

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