Electronic circutt board

Abstract

In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency signal, and the semi-rigid cable comprises a central conductor, an outer conductor, and an insulating layer between the central conductor and the outer conductor.

Description

technical field [0001] The present invention relates to an electronic circuit board, in particular to a high-frequency electronic circuit board configured with a high-frequency coaxial line capable of transmitting high-frequency signals. Background technique [0002] Electronic components, such as cell phones, use circuits to transmit high and low frequency signals. Integrated high-frequency and low-frequency circuits generally use hybrid substrates, where low-frequency components are placed on FR4, and high-frequency components are placed on ceramic substrates or substrates with low dielectric loss. Although both high frequency and low frequency signals can be transmitted on the same substrate; however, a single metal line must be used for low frequency signals and multiple metal lines (forming waveguide structures such as microstrip lines) for high frequency signals. [0003] figure 1 It is an existing electronic circuit board 10 . The electronic circuit board 10 includ...

AI Technical Summary

Problems solved by technology

However, the disadvantage of this prior art is that the overall impedance of the printed circuit board depends on the thickness (T1, T2) of the two dielectric layers 13, 15, that is, it is affected by the manufacturing specifications and the environment.

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