Reflective mask plate, exposure device and exposure method

Abstract

The invention discloses a reflective mask plate, an exposure device and an exposure method. The reflective mask plate comprises a substrate, wherein the substrate comprises a reflecting region capable of reflecting exposure light, and the part beyond the reflecting region of the substrate is a non-reflecting region which cannot reflect exposure light; and the pattern of the reflective mask plate is formed in the reflecting region. The exposure device comprises any of the reflective mask plates. The exposure method comprises the steps of coating light-sensitive material on the substrate; enabling the exposure light to irradiate to the side with pattern of the reflective mask plate, wherein the exposure light reflected by the pattern of the reflective mask plate is irradiated to the substrate coated with the light-sensitive material for exposure; and forming an exposure pattern on the substrate, wherein an included angle between the side with the pattern of the reflective mask plate and the surface of the substrate, which is positioned at the same side with the exposure light is adjustable. According to the invention, the same reflective mask plate can be used for changing the inclination angle so as to obtain different exposure patterns, thereby enhancing the universality of the reflective mask plate.

Description

technical field [0001] The invention relates to the technical field of photolithography, in particular to a reflective mask, an exposure device and an exposure method. Background technique [0002] Photolithography is a technology commonly used in the electronics industry at present. It is widely used in the manufacture of circuit patterns, the manufacture of filter layers and black matrices in the field of display substrates, and the manufacture of gratings and phase difference plates in the field of stereoscopic displays. In photolithography technology, the exposure process needs to use a mask, and the light passes through the mask to expose the photosensitive material. At present, most of the masks are transmission masks. The common photosensitive materials include photoresist, photoresist , photo-alignment layer, etc. [0003] The process of photolithography used to manufacture circuit patterns is as follows: first deposit a layer of metal or other materials on the subs...

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Problems solved by technology

[0004] However, the problem with the above-mentioned transmissive mask and exposure method in the photolithography technology is that once the required circuit pattern, filter layer, black matrix and grating change, the corresponding transmissive mask must be remanufactured. Stencil, in this way, the versatility of the transmissive mask is relatively poor, and the production cost is relatively high

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