Polyamide composite structures and processes for their preparation field of the invention
A composite structure and composition technology, applied in chemical instruments and methods, synthetic resin layered products, textiles, etc., can solve problems such as poor bond strength, weakened high mechanical properties, and poor bond strength
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[0120] The following materials were used to prepare composite structures and overmolded composite structures according to the present invention and comparative examples.
[0121] Material
[0122] The following materials constitute the compositions used in the Examples and Comparative Examples
[0123] Semi-aromatic polyamide (PA1) : Polyamide made of terephthalic acid and 1,6-hexanediamine (HMD) and 2-methylpentamethylenediamine (MPMD) (HM:MPMD=50:50) and having a melting point of about 305-315°C (PA). The semiaromatic polyamides are commercially available from E.I. du Pont de Nemours.
[0124] Overmolding resin composition (C2) : Composition comprising 50% by weight of long glass fibers and comprising semiaromatic PA1. This composition is commercially available from E.I. du Pont de Nemours.
[0125] Functionalized Polyolefins (Ionomers) : Poly(ethylene / n-butyl acrylate / methacrylic acid) (E / n-BA / MAA) is an ionomer with about 70% neutralization of zinc ions. The i...
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