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Pyramid Grinding Disc

A pyramid and grinding disc technology, applied in the direction of abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of unsuitable crystal fine grinding, shortened service life, short service life, etc., to achieve long service life, stable cutting efficiency and safety good sex effect

Inactive Publication Date: 2019-04-05
DONGGUAN RUNMING ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The grinding discs using the above materials still have the disadvantages of poor wear resistance and short service life, and are not suitable for fine grinding of crystals. Moreover, when the grinding liquid is corrosive, the above-mentioned grinding discs will shorten the service life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Pyramid grinding disc, which includes 60% to 80% (by weight) of diamond powder, and the balance is non-diamond nano-scale polishing material, wherein the non-diamond nano-scale polishing material is one of alumina, cerium oxide, and silicon carbide. Several kinds of mixtures with resin, diamond micropowder and non-diamond nano-scale polishing materials have a mesh number of 600-5000 mesh. When the pyramid grinding disc of this embodiment is processed, the abrasives are mixed and evenly distributed to obtain stable cutting efficiency and longer The service life of diamond micropowder and aluminum oxide, cerium oxide and silicon carbide can be finely ground the crystal without damaging the processed material, no fragments, no scratches, better stability and safety, and due to the diamond micropowder and Aluminum oxide, cerium oxide, and silicon carbide have stable chemical properties, so the pyramid grinding disc of the present invention performs well when used in conjunct...

Embodiment 2

[0028] The difference between this embodiment and the first embodiment is that the non-diamond nanoscale polishing material is cerium oxide instead of aluminum oxide, and the purity of cerium oxide is above 98%. Other technical features of this embodiment are the same as those of Embodiment 1, and will not be repeated here.

Embodiment 3

[0030] The difference between this embodiment and the first embodiment is that the non-diamond nanoscale polishing material is silicon carbide instead of aluminum oxide, and the purity of silicon carbide is above 98%. Other technical features of this embodiment are the same as those of Embodiment 1, and will not be repeated here.

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Abstract

The invention relates to the technical field of a grinding device, in particular to a pyramid grinding plate. The pyramid grinding plate comprises 60%-80% of diamond micro-powder in percent by weight, the balance is non-diamond nanoscale polishing material, wherein the non-diamond nanoscale polishing material is one of aluminum oxide, cerium oxide and silicon carbide or a mixture of one or more of the aluminum oxide, the cerium oxide, and the silicon carbide aw well as resin, and the mesh numbers of the diamond micro-powder and the non-diamond nanoscale polishing material are 600-5000. According to the pyramid grinding plate disclosed by the invention, grinding materials can be uniformly distributed after being mixed, stable cutting efficiency and longer service life can be obtained, the diamond micro-powder, the aluminum oxide, the cerium oxide and the silicon carbide can be used for accurately grinding crystals, processed materials cannot be damaged, no chipping and no scratching exist, the stability and the safety are better, and thus the pyramid grinding plate disclosed by the invention performs well when being used in matching with corrosive grinding liquid as the chemical performances of the diamond micro-powder, the aluminum oxide, the cerium oxide and the silicon carbide are stable.

Description

technical field [0001] The invention relates to the technical field of grinding equipment, in particular to a pyramidal grinding disc capable of finely grinding crystal materials such as gemstones, silicon wafers and wafers. Background technique [0002] In the industry, it is often necessary to treat the surface of the workpiece to achieve a certain level of flatness, especially for crystal materials such as sapphire, silicon wafers, wafers, and substrates, which have higher requirements for surface treatment. Therefore, it is necessary to grind the surface of the workpiece with a grinding disc and a grinding liquid. Enlarging the surface of the grinding disc, it can be seen that the surface has tiny, sharp protrusions. When the grinding disc moves relatively on the workpiece, these sharp protrusions can grind the surface of the workpiece. [0003] The material of the grinding disc is directly related to the service life and grinding effect of the grinding disc. The materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D13/14B24D3/28
Inventor 李卫中
Owner DONGGUAN RUNMING ELECTRONICS TECH
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