Wafer placing clamp for evaporating table

Abstract

The invention belongs to the technical field of integrated circuit manufacture, discloses a clamp for a back metallizing process of a wafer, and in particular relates to a wafer placing clamp for an evaporating table. The wafer placing clamp comprises a ringlike body, and steps are arranged on the inner edge of the ringlike body and are rotatably provided with a plurality of ringlike arms. The wafer placing clamp is characterized in that each ringlike arm comprises an upper arm which is provided with a slide groove, a fastening bolt fixedly connects a lower arm to the lower end of the corresponding slide groove, and a wafer step is arranged at the end of each lower arm. According to the wafer placing clamp for the evaporating table provided by the invention, on the premise of not changing the structure of current devices and not increasing the load of the devices, a better solution is provided for a simultaneous back metallizing process for silicon wafers with various sizes, and meanwhile, the process reliability is further ensured while the operating cost and the valuable target consumption are reduced. The clamp is high in operability, has a simple, ingenious and reasonable structure, and can carry wafers with different size specifications effectively.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and relates to a jig for metallizing the back of a wafer, in particular to a wafer placement jig for an evaporation table. Background technique [0002] At present, during the metallization process on the back of the wafer, the jig used in the vacuum evaporation table can only load the wafer corresponding to the size of the jig itself, which greatly limits the flexibility of use. [0003] In the actual operation process, when there are two or more sizes of wafers that need to be back metallized at the same time, only one of the size specifications can be processed first, and then the other size specification is processed. Wafers are processed, and so on, and all processing requirements are completed through such repeated processes. Such multiple batches of repetitive operations not only greatly increase operating costs such as manpower and power, but also cause a great w...

AI Technical Summary

Problems solved by technology

Such multiple batches of repetitive operations not only greatly increase operating costs such as manpower and power, but also cause a great waste of resources for the repetitive consumption of precious targets.

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