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Airtight capping method for cooling-required FC (flip chip) circuits

A technology of airtightness and circuits, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of FC circuits that cannot meet the requirements of airtightness, and achieve the effect of simple process and easy realization

Active Publication Date: 2015-04-22
WUXI ZHONGWEI GAOKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if the conventional parallel seam welding method is still used to seal the cap, it cannot take into account the airtightness requirements and the internal atmosphere requirements of the FC circuit; and at present, the two have heat dissipation requirements that must be guaranteed by the FC circuit. After sealing the cap, on the one hand It is necessary to ensure the airtightness of the FC circuit, that is, to isolate it from the outside air. On the other hand, it is necessary to ensure that the existence of harmful gases and water vapor in the FC circuit is minimized.

Method used

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  • Airtight capping method for cooling-required FC (flip chip) circuits
  • Airtight capping method for cooling-required FC (flip chip) circuits
  • Airtight capping method for cooling-required FC (flip chip) circuits

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Embodiment 1

[0019] Embodiment 1: An airtight sealing method for FC circuits with heat dissipation requirements, comprising the following process steps:

[0020] Step 101, first, flip-weld the FC chip 1 (that is, the Flip Chip upside-down welding chip) on the substrate 5;

[0021] Step 102, then apply the thermally conductive adhesive 2 on the back of the FC chip 1, and position the cover plate 4 on the outer shell welding ring 3, the inner surface of the cover plate 4 is fully in contact with the thermally conductive adhesive 2; the manufacturer of the thermally conductive adhesive 2 is American Tech Bond company, the model is TB3619;

[0022] Step 103, then put the FC circuit that has not yet been airtightly sealed into a parallel seam welding machine, and perform the first stage seam welding, and seam weld the upper and lower sides of the cover plate 4 with the shell welding ring 3; On the left and right sides of 4, there is no seam welding in the reserved area 6 without seam welding, ...

Embodiment 2

[0027] Embodiment 2: An airtight sealing method for FC circuits with heat dissipation requirements, comprising the following process steps:

[0028] Step 101, first, flip-weld the FC chip 1 (that is, the Flip Chip upside-down welding chip) on the substrate 5;

[0029] Step 102, then apply the thermally conductive adhesive 2 on the back of the FC chip 1, and position the cover plate 4 on the outer shell welding ring 3, the inner surface of the cover plate 4 is fully in contact with the thermally conductive adhesive 2; the manufacturer of the thermally conductive adhesive 2 is American Tech Bond company, the model is TB3619;

[0030] Step 103, then put the FC circuit that has not yet been airtightly sealed into a parallel seam welding machine, and perform the first stage seam welding, and seam weld the upper and lower sides of the cover plate 4 with the shell welding ring 3; On the left and right sides of 4, there is no seam welding in the reserved area 6 without seam welding, ...

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Abstract

The invention provides an airtight capping method for cooling-required FC (flip chip) circuits. The method includes the steps of firstly, welding an FC on a substrate by flip bonding; secondly, coating the back of the FC with heat-conducting glue, positioning a cover plate on a shell welding ring, and allowing the inner surface of the cover plate to fully contact with the heat-conducting glue in an adhered manner; secondly, performing primary seam welding, subjecting upper and lower edges of the cover plate and the shell welding ring to seam welding, and subjecting left and right edges of the cover plate, except for non-welding reserved areas, to seam welding with the shell welding ring; thirdly, solidifying the heat-conducting glue, and exhausting gas in a cavity below the cover plate; fourthly, filling the cavity below the cover plate with nitrogen; and fifthly, subjecting the non-welding reserved areas on the left and right edges of the cover plate to seam welding with the shell welding ring. The method guarantees both airtightness and internal atmosphere to meet the design requirements after the cooling-required FC circuits are capped, and is simple in process and easy to implement.

Description

technical field [0001] The invention relates to a method for capping a chip circuit, in particular to an airtight capping method for an FC circuit requiring heat dissipation. Background technique [0002] Before the present invention appeared, the airtight conventional parallel seam welding method sealing cap of FC circuit (FC: inverted welding chip) (every two corresponding side seams of the square cover plate were welded once) was only suitable for small devices without special heat dissipation requirements. Power chip packaging. At present, with the emergence of high-power FC chips, there are requirements for heat dissipation design. It is necessary to bond the back of the chip with a heat-conducting adhesive cover (the cover can be used as a heat-dissipating plate). Some harmful gases are produced. In this case, if the conventional parallel seam welding method is still used to seal the cap, it cannot take into account the airtightness requirements and the internal atmo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
Inventor 郭伟李宗亚肖汉武敖国军
Owner WUXI ZHONGWEI GAOKE ELECTRONICS