Solid-state imaging device, manufacturing method thereof, and electronic device
A technology of solid-state imaging devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve problems such as difficulty in improving sensitivity
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no. 1 example
[0077] Structure of solid-state imaging device
[0078] Example of placing insulating layers and buried wiring in a stepped structure
[0079] figure 2 is a sectional view of main parts showing the configuration of the solid-state imaging device 1-1 of the first embodiment, and is figure 1 A cross-sectional view near the boundary between the pixel area 4 and the peripheral area 7 in . The configuration of the solid-state imaging device 1 - 1 of the first embodiment will be described below based on a sectional view of main parts here.
[0080] figure 2 The solid-state imaging device 1 - 1 of the first embodiment shown is a solid-state imaging device of a three-dimensional structure in which the sensor substrate 2 and the circuit substrate 9 are laminated as described above. On the front side of the sensor substrate 2 , that is, on the surface facing the circuit substrate 9 , a wiring layer 2 a and a protective film 2 b covering the wiring layer 2 a are provided. On the o...
no. 2 example
[0150] Structure of solid-state imaging device
[0151] Example in which the insulating layer is provided with a stepped structure and the insulating pattern is covered with an insulating film
[0152] Figure 7 A sectional view of main parts showing the structure of the solid-state imaging device 1-2 of the second embodiment, and is figure 1 A cross-sectional view around the boundary between the pixel area 4 and the peripheral area 7 in . The structure of the solid-state imaging device 1-2 of the second embodiment will be described below based on this main part sectional view.
[0153] Figure 7 The solid-state imaging device 1-2 of the second embodiment shown with reference to figure 2 The solid-state imaging device of the first embodiment described above is different in that the insulating layer 41 of the stepped structure has a layer structure, and the other structures are similar to those of the first embodiment.
[0154] That is, the insulating layer 41 has an insu...
no. 3 example
[0182] Structure of solid-state imaging device
[0183] Example of Embedded Wiring Provided with Stepped Insulation Layer and Sensor Substrate Subjected to Etching Back
[0184] Figure 11 is a main part sectional view of the structure of the solid-state imaging device 1-3 of the third embodiment, and is figure 1 A cross-sectional view around the boundary between the pixel area 4 and the peripheral area 7 in . The structure of the solid-state imaging device 1-3 according to the third embodiment will be described below based on this main part sectional view.
[0185] exist Figure 11 The solid-state imaging device 1-3 of the third embodiment shown in the figure 2 The solid-state imaging device of the first embodiment described above is different in the layer structure of the insulating layer 43 having a stepped structure and the embedded portion of the wiring 8, while the other structures are similar to those of the first embodiment.
[0186]That is, the insulating layer ...
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