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Antistatic structure of liquid crystal panel, manufacturing method thereof, and repairing method of connecting wire

A technology for a liquid crystal panel and a manufacturing method, applied in the directions of static electricity, electrical components, nonlinear optics, etc., can solve problems such as poor connection lines of an array substrate, and achieve the effect of avoiding static electricity

Active Publication Date: 2015-09-02
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide an antistatic structure of a liquid crystal panel, a manufacturing method thereof, and a repair method for connecting wires, which solve the problem of static electricity generated when cutting the color filter substrate in the prior art, which easily causes the connecting wires on the array substrate to break down. Bad technical problems

Method used

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  • Antistatic structure of liquid crystal panel, manufacturing method thereof, and repairing method of connecting wire
  • Antistatic structure of liquid crystal panel, manufacturing method thereof, and repairing method of connecting wire
  • Antistatic structure of liquid crystal panel, manufacturing method thereof, and repairing method of connecting wire

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Embodiment 1

[0035] Such as figure 1 and figure 2 As shown, the antistatic structure of a liquid crystal panel provided by the embodiment of the present invention includes several pointed discharge structures 11, external wires L1 and internal wires L0; several pointed discharge structures 11 and external wires L1 are arranged on the same layer on the array substrate 1 middle;

[0036] Several point discharge structures 11 are located in corresponding areas above the connection lines 12 on the edge of the array substrate 1 , and the number of point discharge structures 11 are separated from the connection lines 12 by an insulating layer 13 . The connecting wires 12 in the embodiment of the present invention are a plurality of side-by-side arrangements in a fan shape, and the connecting wires can be scanning lines or data lines, that is, the antistatic structure provided by the embodiment of the present invention can be used to protect scanning lines, to protect data lines. As a preferr...

Embodiment 2

[0046] The embodiment of the present invention also provides a method for manufacturing an antistatic structure, including the following steps:

[0047] S1: Through a patterning process, a pattern including internal wires is formed on the array substrate.

[0048] As a preferred solution, by means of a patterning process, while forming the scan line pattern on the array substrate, corresponding internal wires can also be formed.

[0049] Specifically, the pattern of the mask plate in the patterning process is changed. On the basis of the original scanning line pattern of the mask plate, the corresponding internal wire pattern is added, and then after conventional exposure, etching and other steps, the Scan line patterns and corresponding internal wires can be formed simultaneously.

[0050] S2: Through a patterning process, a pattern including internal wires is formed on the array substrate.

[0051] This step is similar to step S1. On the basis of the original data line pat...

Embodiment 3

[0059] Such as image 3 As shown, the antistatic structure provided in this embodiment is based on Embodiment 1, and its external wires specifically include a first external wire L1, a second external wire L2, a third external wire L3, and a fourth external wire L4, wherein, The first external lead L1 is located between the cutting line and the sealant, and the third external lead L3 is located outside the cutting line. The first external wire L1, the second external wire L2, the third external wire L3 and the fourth external wire L4 are connected end to end to form a closed loop.

[0060] In this embodiment, the charge on the tip discharge structure 11 can also be transferred to the third outer wire L3, then transferred to the via hole 14 through the second outer wire L2 or the fourth outer wire L4, and finally transferred to the array through the inner wire L0 Electrostatic rings within the substrate. Compared with Embodiment 1, the charge distribution on the closed circui...

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Abstract

The embodiment of the invention discloses an antistatic structure of a liquid crystal panel and a manufacturing method thereof, and a repairing method of a connecting line, which belong to the technical field of display and are used for solving the technical problem of badness of a connecting line on an array substrate easily caused by static electricity produced by cutting of a color film substrate in the prior art. The antistatic structure comprises a plurality of point discharge structures, an external lead and an internal lead, wherein the point discharge structures and the external lead are arranged in the same layer in the array substrate; the point discharge structures are positioned in a corresponding region above a connecting line on the edge of the array substrate, and are isolated from one another through an insulating layer; the external lead is provided with a part which is positioned between a cutting line and a frame sealing adhesive of the color film substrate; and one end of the internal lead is positioned between the cutting line and the frame sealing adhesive and is electrically connected with the part, which is positioned between the cutting line and the frame sealing adhesive, of the external lead through a via hole, and the other end of the internal lead is electrically connected with a static ring which is positioned in the array substrate and is connected with a common electrode line. The antistatic structure is applied to protection of connecting lines.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an antistatic structure of a liquid crystal panel, a manufacturing method thereof, and a repairing method of a connecting wire. Background technique [0002] With the continuous development of display technology, thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD) has occupied a dominant position in the field of flat panel display. In the LCD manufacturing process, after the liquid crystal panel is boxed, the edge of the color filter substrate needs to be cut, and electrostatic discharge (Electro-Static discharge, ESD) will occur during cutting. [0003] The edge of the array substrate is arranged on fan-out connection lines, including scanning connection lines and data connection lines. After the color filter substrate is cut, the connection lines on the array substrate will be exposed outside. The static electricity g...

Claims

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Application Information

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IPC IPC(8): G02F1/1362G02F1/13H05F3/04
Inventor 赵婷婷
Owner BOE TECH GRP CO LTD
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