Solid laser and heat-dissipating device thereof

A technology of solid-state lasers and laser devices, which is applied to laser components, lasers, phonon exciters, etc., can solve the problem of low cooling efficiency of laser devices, achieve improved cooling efficiency, small contact area, and thermal isolation.

Active Publication Date: 2013-04-10
ZHEJIANG JIATAI LASER SCI & TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to so

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  • Solid laser and heat-dissipating device thereof
  • Solid laser and heat-dissipating device thereof
  • Solid laser and heat-dissipating device thereof

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[0021] The present invention will be described in detail below with reference to the drawings and specific implementations of the specification.

[0022] Such as figure 1 As shown, the solid-state laser and its laser device heat dissipation device provided by the present invention include a supporting base 1, a mounting plate 2 and a plurality of pressing blocks 3. The mounting plate 2 is used to install laser devices. The supporting base 1 is used to support the mounting plate 2 and realize the connection with other parts of the solid-state laser. The pressing block 3 is used to fix the mounting plate 2 on the top surface of the supporting base 1.

[0023] See again figure 2 , The top surface of the support base 1 has a pit 11, and three grooves 12 are provided on the inner side wall of the pit 11, and each groove 12 communicates with the top surface of the support base 1, and each groove 12 is Two first steel balls 13 are respectively placed, and the two first steel balls 13 are...

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Abstract

The invention discloses a solid laser and a heat-dissipating device of the solid laser. The heat-dissipating device of the solid laser comprises a supporting seat, an installing plate and a plurality of pressing blocks, a pit is arranged on the top face of the supporting seat, at least three grooves are arranged on the inner side wall of the pit, two first steel balls are respectively arranged inside each groove, and the two first steel balls are arranged horizontally in parallel. The outline of the installing plate is matched with the pit, pin shafts corresponding to the grooves are arranged on the side face of the installing plate, the installing plate is arranged inside the pit, and a clearance is reversed between the side wall of the pit and the bottom wall of the pit. The pin shafts are arranged inside the corresponding grooves and are supported between the two first steel balls. The plurality of pressing blocks corresponding to the pin shafts in a one-to-one mode respectively fix the corresponding pin shafts on the top surface of the supporting seat. According to the solid laser and the heat-dissipating device of the solid laser, point contact of the installing plate and the supporting seat is achieved through the first steel balls, a contact area is small, and therefore thermal insulation of the installing plate for installing the laser components and external components is achieved, and cooling efficiency of the laser components is improved.

Description

technical field [0001] The invention relates to a solid laser, in particular to a solid laser and a heat dissipation device for a laser device thereof. Background technique [0002] Laser devices such as pump sources, laser crystals, wavelength conversion devices, frequency modulation devices, and mode locking devices are the main heat sources of the product. If the heat in the laser device cannot be dissipated in time, heat accumulation will occur, making the temperature of the laser device Constantly rising, eventually leading to damage to the laser device. [0003] At present, the heat dissipation method of the laser device is: install the laser device on a metal heat dissipation base (hereinafter collectively referred to as the laser device mounting plate), and cool the laser device mounting plate through air cooling or water cooling, thereby indirectly cooling the laser device. The heat is taken away to achieve the purpose of cooling the laser device. Usually, the las...

Claims

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Application Information

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IPC IPC(8): H01S3/042
Inventor 全鸿雁郑宣成
Owner ZHEJIANG JIATAI LASER SCI & TECH CO LTD
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