Solid laser and heat-dissipating device thereof

Abstract

The invention discloses a solid laser and a heat-dissipating device of the solid laser. The heat-dissipating device of the solid laser comprises a supporting seat, an installing plate and a plurality of pressing blocks, a pit is arranged on the top face of the supporting seat, at least three grooves are arranged on the inner side wall of the pit, two first steel balls are respectively arranged inside each groove, and the two first steel balls are arranged horizontally in parallel. The outline of the installing plate is matched with the pit, pin shafts corresponding to the grooves are arranged on the side face of the installing plate, the installing plate is arranged inside the pit, and a clearance is reversed between the side wall of the pit and the bottom wall of the pit. The pin shafts are arranged inside the corresponding grooves and are supported between the two first steel balls. The plurality of pressing blocks corresponding to the pin shafts in a one-to-one mode respectively fix the corresponding pin shafts on the top surface of the supporting seat. According to the solid laser and the heat-dissipating device of the solid laser, point contact of the installing plate and the supporting seat is achieved through the first steel balls, a contact area is small, and therefore thermal insulation of the installing plate for installing the laser components and external components is achieved, and cooling efficiency of the laser components is improved.

Description

technical field [0001] The invention relates to a solid laser, in particular to a solid laser and a heat dissipation device for a laser device thereof. Background technique [0002] Laser devices such as pump sources, laser crystals, wavelength conversion devices, frequency modulation devices, and mode locking devices are the main heat sources of the product. If the heat in the laser device cannot be dissipated in time, heat accumulation will occur, making the temperature of the laser device Constantly rising, eventually leading to damage to the laser device. [0003] At present, the heat dissipation method of the laser device is: install the laser device on a metal heat dissipation base (hereinafter collectively referred to as the laser device mounting plate), and cool the laser device mounting plate through air cooling or water cooling, thereby indirectly cooling the laser device. The heat is taken away to achieve the purpose of cooling the laser device. Usually, the las...

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to solve the problem that the cooling efficiency of the laser device is not high

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