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Light-emitting device

一种发光装置、发光单元的技术，应用在电路热装置、印刷电路、电固体器件等方向，能够解决散热效能无法被有效提升等问题，达到散热效能提升的效果

Active Publication Date: 2013-04-17
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the traditionally used light emitting diode devices (especially for light emitting diode devices in the form of "thermoelectric integration"), the heat dissipation performance still cannot be effectively improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0054] see Figure 1A to Figure 1D as shown, Figure 1A It is a side view cross-sectional schematic diagram of the heat conduction and insulation unit being arranged at the bottom of the light emitting unit, Figure 1B is a schematic side view of the substrate unit, Figure 1C is a schematic top view of the substrate unit, Figure 1D It is a side view cross-sectional schematic diagram of the light emitting device. It can be seen from the above figures that the first embodiment of the present invention provides a light emitting device, which includes: a light emitting unit 1 , a heat conducting and insulating unit 2 and a substrate unit 3 .

[0055] First, if Figure 1A As shown, the light-emitting unit 1 includes at least one first conductive support 11 , at least one second conductive support 12 , a housing 14 , at least one light-emitting element 15 and an encapsulant 16 .

[0056] Wherein, the first conductive support 11 and the second conductive support 12 can be separa...

no. 2 example

[0072] see figure 2 As shown, the second embodiment of the present invention provides another substrate unit 3 . Depend on figure 2 and Figure 1B The comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the area of ​​the bottom heat conduction layer 34 is larger than the area of ​​the top heat conduction layer 33, so as to increase the overall performance of the present invention. heat radiation. For example, the bottom heat conduction layer 34 can cover the entire bottom surface of the substrate body 30, so when the heat absorbed by the top heat conduction layer 33 is conducted to the bottom heat conduction layer 34 through the above-mentioned multiple through-type heat conduction structures 35, a larger area The bottom heat conduction layer 34 can provide better heat dissipation.

no. 3 example

[0074] see image 3 As shown, the third embodiment of the present invention provides another substrate unit 3 . Depend on image 3 and Figure 1B The comparison shows that the biggest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, each penetrating heat conduction structure 35 has a through hole 35A penetrating through the substrate body 30 and a hole 35A for partial filling. The heat conductor 35B fills the through hole 35A, and the heat conductor 35B is connected between the top heat conduction layer 33 and the bottom heat conduction layer 34 . For example, the heat conductor 35B does not completely fill the through hole 35A, but is only formed on the inner surface of the through hole 35A. Therefore, since the heat conductor 35B only partially fills the through hole 35A, the cost of materials used for the heat conductor 35B can be effectively reduced in the manufacture of each through-type heat con...

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Abstract

The invention discloses a light-emitting device, which comprises a light-emitting unit and a heat-conducting insulating unit, wherein the light-emitting unit comprise at least one first current conducting bracket, at least one second current conducting bracket, a shell and at least one light-emitting element, wherein the second current conducting bracket is adjacent to the first current conducting bracket; the shell is arranged between the first current conducting bracket and the second current conducting bracket; the light-emitting element is arranged on the first current conducting bracket; the first current conducting bracket is provided with at least one first current conducting part exposed out of the shell, and at least one heat conducting part exposed out of the shell; the second current conducting bracket is provided with at least one second current conducting part exposed out of the shell; and the heat-conducting insulating unit comprises at least one heat-conducting insulating layer formed on the heat conducting part. The heat conducting path and the current conducting path of the light-emitting element can be planned through the design of ''forming the heat-conducting insulating layer on the heat conducting part'', so that the radiating efficiency of the light-emitting device is effectively increased.

Description

technical field [0001] The invention relates to a light emitting device, in particular to a light emitting device which can effectively improve heat dissipation performance. Background technique [0002] Compared with traditional light sources, light-emitting diodes (LEDs) have the advantages of small size, power saving, good luminous efficiency, long life, fast operation response speed, and no pollution from thermal radiation and mercury and other toxic substances. Therefore, in recent years, Light-emitting diodes have been widely used. In the past, the brightness of light-emitting diodes could not replace traditional lighting sources. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high lighting brightness have been developed, which can replace traditional lighting sources. [0003] However, the heat dissipation performance of the traditionally used LED devices (especially for LED devices in the form of "thermoelectri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/62H01L33/647H05K1/0206H05K2201/10106H05K2201/10969H01L2224/48091H01L2224/48247H01L2924/1815H01L2924/00014
Inventor 许世昌李琮祺李柏纬
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD
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