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Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure

A technology of PCB board and welding area, which is applied in the field of anti-soldering short-circuit structure, can solve problems such as short-circuit prone to occur, and achieve the effects of ensuring welding quality, increasing isolation, and avoiding short-circuit phenomenon

Active Publication Date: 2013-05-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
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Problems solved by technology

[0004] The object of the present invention is to provide a structure for preventing soldering short circuit of a PCB board and a PCB board having the structure, so as to solve the problem that a short circuit phenomenon easily occurs between adjacent pads in the prior art when soldering

Method used

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  • Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure
  • Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure

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Embodiment Construction

[0023] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0024] see figure 1 As shown, on the PCB board 10' of the prior art, a certain degree of isolation is provided between the adjacent pads 30' of the soldering area 20' to ensure the interconnection between the functional modules. However, due to The isolation between adjacent pads 30 ′ may easily cause a short circuit between adjacent pads 30 ′ during soldering, thereby affecting soldering quality and further affecting production efficiency of products.

[0025] see figure 2 As shown, the present invention provides a structure for preventing soldering short circuit of a PCB board, including a soldering area 20 arranged on the PCB board 10, at least two soldering pads 30 arranged at intervals are provided within the scope of the soldering area 20, and The surface of the soldering area is provided w...

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Abstract

The invention provides astructure preventing short circuit caused by soldering of a PCB (Printed Circuit Board) board. The structure preventing short circuit caused by soldering comprises a soldering area on the PCB board, wherein at least two solder pads which are arranged at intervals are arranged in the range of the soldering area, a solder mask is arranged on the surface of the soldering area, and printing ink is printed on the solder mask in a silk-screen mode. On the traditional PCB board, the soldering area easily causes adjacent solder pads to generate a short-circuit phenomenon during soldering, so as to influence the soldering quality and further influence the production efficiency of products. In the invention, as the printing ink is printed on the soldering area in the silk-screen mode, the isolation degree between the adjacent solder pads is increased, therefore the short-circuit phenomenon between the adjacent solder pads during soldering is effectively avoided, and further the soldering quality is ensured. The invention also provides the PCB board.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a structure for preventing a soldering short circuit of a PCB board and a PCB board with the structure. Background technique [0002] In electronic products, the interconnection between functional modules is mainly the interconnection between PCB (Printed Circuitboard, circuit board) and FPC (Flexible Printed Circuit, flexible circuit board) or the interconnection between FPCs, specifically, The FPC of one functional module and the PCB of another functional module are interconnected by manual welding, or the FPCs corresponding to the two functional modules are interconnected by manual soldering. On the traditional PCB board 10', the structure of the soldering area provided is as shown in the attached manual. figure 1 As shown, a certain degree of isolation is provided between adjacent pads 30' to ensure the interconnection between functional modules. However, due to the limit...

Claims

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Application Information

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IPC IPC(8): H05K1/11
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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