Method for obtaining a plurality of W-Ti-N films with different W/Ti ratios by one time sputtering
A secondary sputtering and proportional technology, which is applied in the field of W-Ti-N thin films, can solve the problems of insignificant effects and limited changes in the comprehensive performance of W-Ti-N thin films, and achieves low cost, easy control of parameters, and high process efficiency. simple effect
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Embodiment 1
[0020] (1) The sputtering equipment adopts PSII type double discharge controlled microwave ECR plasma injection device in all directions, and the sputtering targets are pure metal W target (purity ≥99.99%) and pure metal Ti target (purity ≥99.99%). The two targets are placed at 90° to each other and at 45° to the sputtering table. The distance between the center of the double target and the sample table is 83mm. The base material is 40Cr stainless steel (10mm×10mm×3mm). and the right order is placed in turn;
[0021] (2) The stainless steel sample is cleaned by reverse sputtering, the power is 100W, and the cleaning is 10min;
[0022] (3) The stainless steel sample is sent into the main sputtering chamber, and both the target and the sample are cooled by circulating water;
[0023] (4) Add reactive gas N into the main sputtering chamber 2 (purity ≥99.99%) and sputtering gas Ar (purity ≥99.99%), the ratio of the two is 1:3, and the initial vacuum degree is ≥5×10 -4 Pa, co-sp...
Embodiment 2
[0027] (1) The sputtering equipment adopts PSII type double discharge controlled microwave ECR plasma injection device in all directions, and the sputtering targets are pure metal W target (purity ≥99.99%) and pure metal Ti target (purity ≥99.99%). The two targets are placed at 90° to each other and at 45° to the sputtering table. The distance between the center of the double target and the sample table is 83mm. The base material is 40Cr stainless steel (10mm×10mm×3mm). and the right order is placed in turn;
[0028] (2) The stainless steel sample is cleaned by reverse sputtering, the power is 100W, and the cleaning is 10min;
[0029] (3) The stainless steel sample is sent into the main sputtering chamber, and both the target and the sample are cooled by circulating water;
[0030] (4) Add reactive gas N into the main sputtering chamber 2 (purity ≥99.99%) and sputtering gas Ar (purity ≥99.99%), the ratio of the two is 1:3, and the initial vacuum degree is ≥5×10 -4 Pa, co-sp...
Embodiment 3
[0033] (1) The sputtering equipment adopts P SII type double discharge controlled microwave ECR plasma injection device in all directions, and the sputtering targets are pure metal W target (purity ≥99.99%) and pure metal Ti target (purity ≥99.99%), The two are placed at 90° to each other and are placed at 45° between the sputtering stage. The distance between the center of the double target is 83mm from the sample stage. The order of left and right is placed in turn;
[0034] (2) The stainless steel sample is cleaned by reverse sputtering, the power is 100W, and the cleaning is 10min;
[0035] (3) The stainless steel sample is sent into the main sputtering chamber, and both the target and the sample are cooled by circulating water;
[0036] (4) Add reactive gas N into the main sputtering chamber 2 (purity ≥ 99.99%) and sputtering gas Ar (purity ≥ 99.99%), the ratio of the two is 1:4, the initial vacuum degree ≥ 5 × 10 -4 Pa, co-sputtering with two targets, power is 200W, s...
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