Thermal head and method of manufacturing the same, and thermal printer
A manufacturing method and thermal head technology, applied in the field of thermal heads, can solve problems such as thermal head printing durability damage, protective film faults, thin electrode faults and burrs, etc., to improve heat transfer efficiency and reduce height difference , Improve the effect of contact
Inactive Publication Date: 2013-05-15
SEIKO INSTR INC
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Problems solved by technology
In addition, since the film thickness of the thin electrode part is thinner than that of the thick electrode part, breaks and burrs of the thin electrode part occur at the front end of the thick electrode part.
Therefore, in the front end portion of the thick electrode portion, there is a high possibility that the thin electrode portion is not formed as a continuous film and a defect such as interruption occurs.
Therefore, when a defect occurs in the thin electrode portion, a break or the like occurs in the protective film protecting the thin electrode portion, resulting in a problem that the printing durability of the thermal head is impaired.
Method used
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no. 2 Embodiment approach ＞
[0080] Next, a thermal head according to a second embodiment of the present invention will be described with reference to the drawings.
[0081] In the first embodiment, as the shape of the support substrate 3 included in the thermal head 1, the image 3 The flat plate shape shown. On the other hand, in the second embodiment, a shape in which a concave portion is provided on the support substrate 3 is adopted. Figure 11 It is a cross-sectional view of the heating resistor 7 of the thermal head 1 along the arrow A-A. A rectangular recess 50 extending in the longitudinal direction of the support substrate 3 is provided on the upper end surface (surface) of the support substrate 3 , and by covering the recess 50 with the upper substrate 60 , a cavity is formed between the upper substrate 60 and the support substrate 3 department.
[0082] The support substrate 3 is, for example, an insulating substrate such as a glass substrate or a silicon substrate having a thickness of app...
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Abstract
The invention provides a thermal head and a method of manufacturing the same, and a thermal printer, improving the durability and efficiency of printing. The thermal head includes a support substrate (3), a glaze layer (5), heating resistors (7) provided on the surface of the glaze layer (5), and a pair of electrode portions (8) formed on the surface of the heating resistor (7). Each of the pair of electrode portions (8) includes a thick electrode portion (30) and a thin electrode portion (31). The thick electrode portion (30) includes a flat surface (30a) having a thickness h1 and an inclined surface (30b) which is provided from the flat surface (30a) toward the center C of the surface of the heating resistor (7). The thin electrode portion (31) has a thickness h2 smaller than the thickness h1, and is formed so as to cover the thick electrode portion (30).
Description
technical field [0001] The present invention relates to a thermal head, a manufacturing method of the thermal head and a thermal printer. Background technique [0002] Conventionally, a thermal print head used in a thermal printer is known to print on a thermal recording medium such as thermal paper by selectively driving a plurality of heating elements according to print data (for example, refer to Patent Document 1). The heating element of the thermal printhead includes a heating resistor and electrodes for supplying power to the heating resistor, and a pair of electrodes are connected to both sides of the heating resistor. [0003] In order to improve the printing efficiency of the thermal head, it is preferable to reduce the ratio of the wiring resistance of the electrodes to the resistance of the heating resistor to reduce power loss in the electrodes. Furthermore, the ratio of the wiring resistance value of the electrode to the resistance value of the heating resistor...
Claims
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IPC IPC(8): B41J2/335
CPCB41J2/335H05K13/00B41J2/33515B41J2/3354B41J2/3351B41J2/33545B41J2/3357Y10T29/49083
Inventor 师冈利光顷石圭太郎东海林法宜三本木法光
Owner SEIKO INSTR INC