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Three-dimensional perspective imaging technology of ultrasonic microscopy

An ultrasonic, three-dimensional technology, applied in the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, image data processing, instruments, etc.

Inactive Publication Date: 2013-05-15
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional C-scans can only display two-dimensional plane information, while B-scans can only display depth information

Method used

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  • Three-dimensional perspective imaging technology of ultrasonic microscopy
  • Three-dimensional perspective imaging technology of ultrasonic microscopy
  • Three-dimensional perspective imaging technology of ultrasonic microscopy

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The specific embodiment of the present invention is described in detail below:

[0010] 1. Full-wave data acquisition

[0011] On the A-scan waveform, adjust the Z-direction coordinates of the ultrasonic transducer so that the transducer is focused on the plane of the measured target. Set track gate and data gate, including start time, gate width and threshold voltage. Include the waveform area of ​​interest in the data so that the threshold is higher than the noise amplitude and lower than the signal amplitude. The function of the tracking gate is to keep the relative position of the data gate and the waveform fixed when the measured surface is uneven or inclined. .

[0012] During scanning, each XY coordinate point records a waveform, which is stored in a three-dimensional array data structure. The three dimensions represent the X coordinate, Y coordinate and time-of-flight (TOF) respectively, and the value of the array is the voltage amplitude of each point.

[0...

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PUM

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Abstract

The invention discloses a three-dimensional perspective imaging technology of ultrasonic microscopy, comprising the following steps of: when a computer three-dimensional imaging technology is applied to the ultrasonic microscopy, processing full wave data acquired by ultrasonic microscopy scanning, and building a three-dimensional mathematic model; layering the data in a matrix of the mathematic model by a computer three-dimensional image engine, rendering color for each layer of data according to the amplitude in the mathematic model, and setting transparency, and then arranging each layer of image according to a Z coordinate to form a three-dimensional perspective multi-layer rendering model. The three-dimensional perspective imaging technology can be used for visually displaying the internal structure and defects of a tested workpiece, and realizing the rotation and zoom functions of a three-dimensional graph; when a section is specified, the technology can be used for partially drawing the data in the three-dimensional mathematic model according to the function and the section view direction of the section, and also performing multi-layer transparent rendering so as to realize the section view effect.

Description

1. Technical field [0001] The invention designs and manufactures a computer three-dimensional imaging technology applied in ultrasonic microscopic detection, and is suitable for the field of ultrasonic microscopic detection and imaging of electronic packaging and composite materials. 2. Background technology [0002] Ultrasonic microscopic inspection technology is a very effective means to detect internal defects of precision structures such as electronic packaging. It is a technology for visual observation of the microstructure of microscopic imaging. It is mainly aimed at the failure analysis of semiconductor devices, chips, and materials. It can check the lattice structure inside the material, impurity particles, internal cracks, layered defects, voids, and bubbles. wait. [0003] In ultrasonic microscopic inspection, imaging technology is one of the key technologies. The full-wave data of ultrasonic microscopic scanning includes two-dimensional plane information and de...

Claims

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Application Information

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IPC IPC(8): G01N29/06G06T19/00
Inventor 徐春广门伯龙刘中柱赵新玉肖定国卢宗兴郭祥辉杨柳王宏博阎红娟
Owner BEIJING INSTITUTE OF TECHNOLOGYGY