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Storage device and method of making the same

A technology for storage devices and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as the difficulty of miniaturization of mobile hard disks, and achieve the effect of reducing volume

Active Publication Date: 2016-01-20
PHISON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the size of the mobile hard disk can be moderately reduced by miniaturization of the circuit board, it is quite difficult to further miniaturize the mobile hard disk due to the size of the metal shell of the connector.

Method used

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  • Storage device and method of making the same
  • Storage device and method of making the same
  • Storage device and method of making the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Figure 1A and Figure 1B They are schematic diagrams of a storage device in relative perspectives according to an exemplary embodiment of the present invention. Figure 2A and Figure 2B yes Figure 1A Schematic diagram of the assembly of some components in the storage device. Please also refer to Figure 1A , Figure 1B and Figure 2A , Figure 2B , in this exemplary embodiment, the storage device 10 includes a circuit board 100 , an electronic component package 200 and a terminal module 300 . The circuit board 100 has a connection end E1, a first surface S1 and a second surface S2 opposite to each other, a plurality of through holes V1 connecting the first surface S1 and the second surface S2, and a plurality of first surface S1 on the first surface S1. A metal pad 110, and a plurality of second metal pads 120 on the second surface S2. The connection end E1 is a mating connector for connecting to a host system (not shown). That is to say, the storage device 10...

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PUM

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Abstract

The invention relates to a storage device, which includes a circuit board, an electronic component package and a terminal module. The circuit board has a first surface and a second surface that are opposite to each other, a plurality of through holes connecting the first surface and the second surface, a plurality of first metal pads located on the first surface, and a plurality of first metal pads located on the second surface. a plurality of second metal pads. The electronic component package is disposed on the first surface. The terminal module is arranged on the first surface. The terminal module has a plurality of first contact parts and a plurality of second contact parts. The first contact portion passes through the through hole correspondingly and protrudes from the second surface. The second contact portion is electrically connected to the first metal pad correspondingly. The orthogonal projected area of ​​the electronic component package on the first surface is smaller than the area of ​​the first surface.

Description

technical field [0001] The invention relates to a storage device and a manufacturing method thereof, in particular to a storage device using a rewritable non-volatile memory as a storage medium and a manufacturing method thereof. Background technique [0002] With the development of multimedia technology, the digital files produced become larger and larger. Although the traditional 1.44MB floppy disk is easy to carry, its capacity can no longer meet the current demand. In addition, although the hard disk with the traditional magnetic disk structure can provide a large storage space, it is inconvenient for users to carry it because of its large volume. Because the rewritable non-volatile memory has the characteristics of data non-volatility, power saving, small size and no mechanical structure, it is suitable for portable applications and is most suitable for such portable battery-powered products. superior. A mobile hard disk is a storage device that uses a NAND flash mem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/115H01L21/8247H10B43/40
Inventor 林为鸿锺弘毅
Owner PHISON ELECTRONICS