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Electric power converter having plurality of semiconductor modules arrayed in successive layers

A technology of power converters and semiconductors, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, output power conversion devices, etc., can solve problems such as increased resistance, and achieve the effect of improving manufacturing efficiency

Active Publication Date: 2013-05-15
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such an elongated narrow shape of the AC bus bar is disadvantageous in that the resistance is increased and it is difficult to form the AC bus bar (for example, form the AC bus bar from a metal sheet)

Method used

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  • Electric power converter having plurality of semiconductor modules arrayed in successive layers
  • Electric power converter having plurality of semiconductor modules arrayed in successive layers
  • Electric power converter having plurality of semiconductor modules arrayed in successive layers

Examples

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no. 1 example

[0024] Will refer to Figure 1 to Figure 5 The first embodiment of the power converter indicated by reference numeral 1 is described. The power converter 1 includes a stacked layer unit 10 formed of six semiconductor modules 2 arranged in a plurality of continuous layers along the x direction (stacking direction). The layer position of the semiconductor module alternates with the layer position of the plurality of cooling pipes 110 contacting the semiconductor module. The coolant 14 passes through the flow channel 11 formed inside the cooling pipe 110 to cool the semiconductor module 2. Each semiconductor module 2 has an internal semiconductor module 23 (see Figure 5 ) Of the body 20, in which two power terminals protrude from the body 20, and the power terminals are uniformly denoted by reference numeral 21. The power terminals 21 each extend in the z direction (projection direction) at right angles to the x direction.

[0025] As described below, a plurality of bus bars (a ...

no. 2 example

[0056] Will refer to Image 6 with Figure 7 The second embodiment is described. The components corresponding to the components of the first embodiment are denoted by the same reference numerals as those in the first embodiment, and only the different points from the first embodiment will be described in detail. As shown in the figure, the sealing member 31 of the first embodiment is replaced by a sealing member 131 which has a flat open rectangular shape (ie, has a substantially rectangular outer and inner peripheral edges viewed in the z direction). The sealing member 131 not only retains the positive bus bar 3a and the negative bus bar 3b as in the first embodiment, but also serves to retain each AC bus bar 4 (4a to 4b). Specifically, the terminal forming portion 45 of the AC bus bar 4 and multiple portions of the positive bus bar 3 a are sealed in the sealing member 131, and the negative bus bar 3 b is installed on the upper surface of the sealing member 131. A single inte...

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PUM

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Abstract

In an electric power converter, a stacked-layer unit has a plurality of semiconductor modules arrayed as layers along a stacking direction, each semiconductor module containing a semiconductor element and a pair of power terminals protruding outward in a protrusion direction at right angles to the stacking direction, each pair consisting of an AC terminal and a positive-polarity or negative-polarity power terminal. The semiconductor modules are arranged with the positive-polarity and negative-polarity power terminals in a single column at one side of the stacked-layer unit, and respectively connected to a positive-polarity busbar and negative-polarity busbar which are located at that side and which are separated by a fixed spacing in the protrusion direction, while the AC terminals of each layer-adjacent pair of semiconductor modules are connected in common to a corresponding one of a plurality of AC busbars.

Description

Technical field [0001] The present invention relates to a power converter having a plurality of semiconductor modules arranged in a plurality of continuous layers, wherein each semiconductor module has an internal semiconductor element and two power terminals. Background technique [0002] Various types of power converters for converting between DC power and AC power based on a stacked layer unit are known, where the stacked layer unit has: a plurality of consecutive layers of semiconductor modules, where each semiconductor module contains internal semiconductor elements And two power terminals; and a plurality of cooling pipes arranged in a plurality of layers corresponding to the plurality of layers constituted by the semiconductor module for cooling the semiconductor module. An example of such a power converter is described in Japanese Patent Publication No. 2011-135737 referred to as reference D1 below. [0003] FIG. 9 is a plan view showing the power converter of reference D1...

Claims

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Application Information

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IPC IPC(8): H02M7/48
CPCH02M7/003H02M7/537H01L2924/0002G06F1/20H02M7/162H01L23/473H01L2924/00
Inventor 山浦慧
Owner DENSO CORP
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