Mounting pressure test mechanism used for ball grid array (BGA) repair work

A pressure test and work technology, applied in the direction of measuring force, measuring device, instrument, etc., can solve problems such as excessive mounting pressure

Inactive Publication Date: 2013-05-22
XIAN ZHONGKEMAITE ELECTRONICS TECH EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned prior art, the object of the present invention is to provide a mounting pressu

Method used

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  • Mounting pressure test mechanism used for ball grid array (BGA) repair work

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Embodiment Construction

[0010] As shown in the drawings, the present invention is a mounting pressure testing mechanism for BGA rework, including a base 2, and a guide rail mounting frame 12 that forms an integral structure with the base 2, and the rail mounting frame 12 is provided with a timing belt 13 and a slide Rail 14, the upper end of synchronous belt 13 is connected with stepping motor 11, the lower end passes through pulley 16, PCB board fixing mechanism 4 is arranged on the base 2, and the sliding mounting bracket 8 is vertically installed on the sliding rail 14, and is connected with synchronous belt 13 , the pressure sensor 9 and the stepper motor controller 15 are installed on the top of the sliding mounting frame 8, and the pressure sensor 9, the stepper motor controller 15 and the stepper motor 11 are connected by wires 10, the BGA welding probe 6, the pressure detection The rod 5 and the hot air nozzle 1 are installed on the lower part of the sliding mounting frame 8 through the connec...

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Abstract

The invention provides a mounting pressure test mechanism used for ball grid array (BGA) repair work. The mounting pressure test mechanism used for the BGA repair work comprises a base and a guide rail mounting support, the guide rail mounting support and the base form an integral structure, a synchronous belt and a sliding rail are arranged on the guide rail mounting support, the upper end of the synchronous belt is connected with a stepping motor, and the lower end of the synchronous belt penetrates through a pulley. A printed circuit board (PCB) fixing mechanism is arranged on the base, and a sliding mounting support is perpendicularly arranged on the sliding rail and connected with the synchronous belt. A pressure sensor and a stepping motor controller are arranged on the upper portion of the sliding mounting support. The pressure sensor, the stepping motor controller and the stepping motor are connected through a wire, a BGA welding probe, a pressure detecting bar and a hot wind nozzle are arranged on the lower portion of the sliding mounting support by a connecting rod, the pressure detecting bar penetrates through the sliding mounting support and connected with the pressure sensor on the upper portion of the sliding mounting support, and an elastic element and the hot wind nozzle at the lower end of the pressure detecting bar can be contacted with a packaged BGA element simultaneously. The pressure sensor is utilized to control the stepping motor and avoids oversized or undersized pressure by BGA mounting.

Description

technical field [0001] The invention belongs to the structural field of BGA rework workstations, and in particular relates to a mounting pressure testing mechanism for BGA rework work. Background technique [0002] With the development of science and technology, large-scale integrated circuits are widely used in all walks of life, and the welding components on the integrated circuit PCB board are chip-based and integrated, and the welding components are becoming more and more complex. Many PCB components are used The BGA packaging method has the advantages of small packaging area, many pins, powerful functions and low cost. But its disadvantages are also obvious, that is, if a small chip is broken on the PCB board using BGA soldering method, it may lead to the scrapping of the whole PCB soldering board. If you want to repair it, you must use the same packaging method, so BGA rework workstation However, the PCB board using BGA packaging technology is used for rework, which g...

Claims

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Application Information

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IPC IPC(8): G01L1/00
Inventor 张国琦蒲维新
Owner XIAN ZHONGKEMAITE ELECTRONICS TECH EQUIP
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