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Micro device assembly system and assembly method thereof

An assembly system and device technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as difficulty in manual process realization, and achieve the effect of ensuring accuracy, improving clamping efficiency and clamping quality, and high assembly accuracy

Active Publication Date: 2015-10-28
山东泉亿机械制造有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, it is very difficult to realize the manual process

Method used

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  • Micro device assembly system and assembly method thereof
  • Micro device assembly system and assembly method thereof
  • Micro device assembly system and assembly method thereof

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Embodiment Construction

[0034] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0035] ginseng Figure 1 to Figure 6 As shown, the tiny device assembly system includes a secondary adsorption system 1, and the secondary adsorption system 1 includes primary adsorption heads 1-4 and secondary adsorption heads 1-3. The lower end of the primary suction head 1-4 is provided with a groove 1-9; the secondary suction head 1-...

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Abstract

The invention discloses a small component assembly system and an assembly method of the small component. The small component assembly system and the assembly method of the small component are used for gluing thin-walled pieces and to-be-machined components. The small component assembly system comprises an assembly platform, a secondary adsorption system, a first adjusting device, a microscope system, and a compressing system. The assembly platform is used for loading the to-be-machined components, the secondary adsorption system comprises a primary adsorption head and a secondary adsorption head, the primary adsorption head and the secondary adsorption head are connected in a detachable mode, a compressive surface is defined on the secondary adsorption head, an adsorption hole used for adsorbing the thin-walled pieces is formed at the lower end of the secondary adsorption head, the first adjusting device is connected with the secondary adsorption system and controls the secondary adsorption system to move, the microscope system is located on the upper position of the assembly platform, the compressive system comprises a second adjusting device and a compressing piece, the secondary adjusting device is connected with the compressing piece and controls the compressing piece to move, and a seal surface which can act on the compressive surface is arranged on the compressing piece. The small component assembly system has the advantages of being capable of greatly improving clamping efficiency and clamping quality of the thin-walled pieces, high in assembly accuracy, and free of displacement change of the thin-walled pieces in the process of solidification.

Description

technical field [0001] The invention relates to an assembly system and an assembly method for gluing thin-walled parts and devices to be processed. Background technique [0002] Micro-miniaturization technology is one of the important dual-use technologies facing the 21st century, and its development has a profound impact on the development of related technologies such as civil and national defense. With the development of science and technology, the requirements for the function, performance and reliability of micro-miniature devices are getting higher and higher, and the demand for precision micro-miniature parts and products is also becoming more and more urgent. The geometric size of micro-miniature parts is generally in the range of submicron to tens of millimeters, and its processing technology (such as silicon micro process, LIGA process and precision machining technology, etc.) has reached a certain level of development, but the corresponding assembly technology is s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P19/00
Inventor 陈涛孙立宁潘明强刘吉柱王阳俊陈立国
Owner 山东泉亿机械制造有限公司